Packaging Engineer Intern

MACOM; Morrisville (NC); On-site; USD 45,000 - 134,000; Full time

Job summary

MACOM, a global leader in RF, microwave, and photonics, seeks a Packaging Engineer Intern to join the Engineering team in the United States. The 12-week internship offers hands-on project work, mentoring, and opportunities to present results at a poster session.

Responsibilities include contributing to a defined project, gaining practical experience, attending webinars, networking events, and collaborating with engineers across sites while developing CAD drawings and process improvement methods.

Qualifications

• Currently enrolled in a bachelor’s or master’s degree in mechanical engineering, manufacturing engineering, or related discipline.
• Good communication skills and willingness to work on a team.
• Some travel to other MACOM sites (in U.S.) may be required.
• U.S. Citizen or Permanent Resident Status.

Responsibilities

• Be given an individual and well-defined project with set outcome goals.
• Gain hands on experience.
• Receive excellent training and ongoing supervision.
• Be invited to attend an intern webinar series.
• Attend networking/social events.
• Attend and present at Poster Session about each intern's project successes and pitfalls.
• Receive formal, written feedback.

Skills

Mechanical design understanding

Teamwork

Communication skills

Academic project experience

Education

Bachelor's or Master's in Mechanical Engineering or related field

Tools

AutoCAD

SolidWorks

MS Office

Job description

MACOM (NASDAQ: MTSI) is a global leader in the design and manufacture of advanced semiconductor products across a diverse range of end markets, including Data Centers, Telecommunications, Industrial and Aerospace and Defense. We develop innovative, cutting-edge technologies and products across the spectrum of radio frequency (RF), microwave, millimeter wave, photonics and high-speed analog technologies. Our solutions support critical network infrastructure applications like artificial intelligence, high performance computing, satellite communications, radar, unmanned aerial vehicles, medical equipment, test and measurement and advanced wireless networks.

MACOM has more than 75 years of expertise in semiconductor process development, wafer fabrication, circuit design, advanced packaging, systems architecture and applications engineering. We are committed to our customers’ success. We partner with customers to help solve their most challenging problems by providing semiconductor solutions that are at the forefront of the highest power, highest frequency and/or highest data rates.

Leading technologies, innovative products and driven employees. Come be a part of MACOM and help advance the next generation of connectivity infrastructure!

Packaging Engineer Intern

Role Overview:

As a member of the Packaging Engineering team, the Packaging Engineering Intern will work alongside experienced engineers providing mentoring, guidance, and introductions to colleagues.

This Internship with MACOM will help the Intern to gain valuable work experience in a key discipline, build professional relationships, and take ownership of a business-critical project.

During the 12 weeks each Intern will:

• Be given an individual and well-defined project with set outcome goals
• Gain hands on experience
• Receive excellent training and ongoing supervision
• Be invited to attend an intern webinar series
• Attend networking/social events
• Attend and present at Poster Session about each Interns project successes and pitfalls
• Receive formal, written feedback

Requirements:

• Currently enrolled in a bachelor’s or master’s degree in mechanical engineering, Manufacturing Engineering, or other related discipline
• Good communication skills and willingness to work on a team
• Some travel to other MACOM sites (in U.S.) may be required
• U.S. Citizen or Permanent Resident Status

Prerequisite Skills and Experience:

• Understanding of mechanical design and creating drawings
• Knowledge of Statistical Process Control, Design of Experiments, and Process Improvement Methodology
• Proficient with Microsoft Word, Excel, and PowerPoint
• Experience with CAD software (AutoCAD and SolidWorks preferable)

Additional Desirable Skills:

• Understanding of thermal modeling and finite element analysis (ANSYS preferable)

EEO:

MACOM is an Equal Opportunity Employer committed to a diverse workforce. MACOM will not discriminate against any worker or job applicant on the basis of race, color, religion, sex, gender identity, sexual orientation, national origin, age, disability, genetic information, veteran status, military service, marital status, or any other category protected under applicable law.

Reasonable Accommodation:

MACOM is committed to working with and providing reasonable accommodations to qualified individuals with physical and mental disabilities. If you have a disability and are in need of a reasonable accommodation with respect to any part of the application process please call [phone] or email [e-mail]. Provide your name, phone number and the position title and location in which you are interested, and nature of accommodation needed, and we will get back to you. We also work with current employees who request or need reasonable accommodation in order to perform the essential functions of their jobs.