Senior RFIC Packaging Designer - 50 GHz, High-Frequency

Falcomm; Atlanta (GA); On-site; USD 90,000 - 120,000; Full time

Benefits offered by this job

Competitive Salary and Equity Package

Comprehensive Health, Dental, and Vision Insurance

401(k) Retirement Plan

Paid Time Off (PTO) and Sick Leave

Job summary

A semiconductor research company in Atlanta is seeking an IC Packaging Designer to develop innovative packaging solutions for RF integrated circuits. This full-time, onsite role involves designing and optimizing complex packages for high-frequency performance while collaborating closely with RFIC designers and testing teams. Ideal candidates will have a Bachelor's degree in a relevant field and 3-5 years of experience in RFIC semiconductor packaging. A competitive salary and comprehensive benefits package are offered.

Qualifications

• 3‑5 years of experience designing advanced RFIC semiconductor packages up to 50 GHz.
• Strong foundation in electrical, thermal, materials, or mechanical engineering principles relevant to IC packaging.
• Familiarity with scripting or automation skills (Python, TCL, Perl, or shell) to support design workflows.

Responsibilities

• Design and develop RFIC packages and substrates optimized for high-frequency performance.
• Create package layouts and bond diagrams using semiconductor packaging EDA tools.
• Generate package documentation, fabrication drawings, and assembly specifications.
• Collaborate with RFIC designers to co-optimize chip and package performance.

Education

Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or related discipline

Tools

Cadence Allegro APD/SiP

Mentor Xpedition

HFSS

Q3D

PowerSI

CAM350

Valor

Calibre

Ansys Electronics Desktop

Job description

A semiconductor research company in Atlanta is seeking an IC Packaging Designer to develop innovative packaging solutions for RF integrated circuits. This full-time, onsite role involves designing and optimizing complex packages for high-frequency performance while collaborating closely with RFIC designers and testing teams. Ideal candidates will have a Bachelor's degree in a relevant field and 3-5 years of experience in RFIC semiconductor packaging. A competitive salary and comprehensive benefits package are offered.