Principal RF Packaging Architect & Innovator

Skyworks Solutions, Inc.; Richardson (TX); On-site; USD 123,000 - 255,000; Full time

Benefits offered by this job

Healthcare benefits

401(k) plan and company match

Employee stock purchase plan

Paid time off

Job summary

Skyworks Solutions, Inc. is seeking a Principal Research Scientist to lead RF-based 3D heterogeneous integration initiatives. The role focuses on developing next-generation SiP, WLP, and heterogeneous packaging technologies for radar, communications, and emerging applications.

The successful candidate will guide multidisciplinary R&D efforts, drive technology transition, and contribute to Skyworks' long-term leadership in advanced packaging and intellectual property creation.

Qualifications

• Ph.D. in Electrical Engineering or related field.
• 8+ years in advanced microelectronics packaging or heterogeneous integration.
• Experience leading research programs from concept to deployment or commercialization.
• Strong knowledge of SiP, WLP, 2.5D/3D integration.
• Proven patent/publication/conference record.
• Ability to guide multidisciplinary teams and communicate across audiences.

Responsibilities

• Lead research and technology development in advanced microelectronics packaging, including 3DHI, WLP, and RF packaging technologies.
• Develop innovative concepts and integration approaches for RF systems and SiP solutions.
• Evaluate materials, architectures, and processes to improve RF performance, miniaturization, reliability, and cost.
• Define and execute technology roadmaps aligned with business strategy and product needs.
• Collaborate with cross-functional teams and pursue externally funded research opportunities.
• Publish technical papers, disclosures, and patents; present findings at conferences.

Skills

8+ years experience

Leadership of research programs

Technical communication

Strategic technology development

Education

Ph.D. in Electrical Engineering

Job description

Skyworks Solutions, Inc. is seeking a Principal Research Scientist to lead RF-based 3D heterogeneous integration initiatives. The role focuses on developing next-generation SiP, WLP, and heterogeneous packaging technologies for radar, communications, and emerging applications.

The successful candidate will guide multidisciplinary R&D efforts, drive technology transition, and contribute to Skyworks' long-term leadership in advanced packaging and intellectual property creation.