Principal Packaging Engineer

Skyworks Solutions, Inc; Richardson (TX); On-site; USD 123,000 - 255,000; Full time

Benefits offered by this job

Health benefits

401(k) with match

Stock purchase plan

Paid time off

Job summary

Skyworks Solutions, Inc. is seeking a Principal Research Scientist to lead RF-based 3D heterogeneous integration initiatives and drive next-gen SiP/WLP technologies.

You will guide multidisciplinary teams, pursue external funding, and publish innovations to strengthen Skyworks' technology leadership. The role emphasizes technical leadership, collaboration across functions, and the translation of research into commercial solutions that support radar, communications, and wireless infrastructure

Qualifications

• Ph.D. in Electrical Engineering, Materials Science, Physics, Mechanical Engineering or related field.
• 8+ years of industrial, government laboratory, or academic research experience in advanced microelectronics packaging, heterogeneous integration, or related fields.
• Proven experience leading research programs from concept to technology demonstration, transition, or commercialization.

Responsibilities

• Lead research and technology development in advanced microelectronics packaging, including 3DHI, WLP, and RF packaging technologies.
• Develop architectures and integration approaches for RF systems and SiP solutions.
• Define roadmaps and collaborate across design, materials, manufacturing, reliability, and business teams.

Skills

RF packaging

3D heterogeneous integration

Wafer-level packaging (WLP)

MCM / chiplet architectures

Leadership of research programs

Patents and publications

Team leadership

Education

Ph.D. in Electrical Engineering / related field

Job description

If you are looking for a challenging and exciting career in the world of technology, then look no further. Skyworks is an innovator of high-performance analog semiconductors whose solutions are powering the wireless networking revolution.Through our broad technology expertise and one of the most extensive product portfolios in the industry, we are Connecting Everyone and Everything, All the Time.

At Skyworks, you will find a fast-paced environment with a strong focus on global collaboration, minimal layers of management, and the freedom to make meaningful contributions in a setting that encourages creative thinking. We are excited about the opportunity to work with you and glad you want to be part of a team of talented individuals who together are changing the way the world communicates.

Requisition ID:78994

If you are looking for a challenging and exciting career in the world of technology, then look no further. Skyworks is an innovator of high-performance analog semiconductors whose solutions are powering the wireless networking revolution.Through our broad technology expertise and one of the most extensive product portfolios in the industry, we are Connecting Everyone and Everything, All the Time.

At Skyworks, you will find a fast-paced environment with a strong focus on global collaboration, minimal layers of management, and the freedom to make meaningful contributions in a setting that encourages creative thinking. We are excited about the opportunity to work with you and glad you want to be part of a team of talented individuals who together are changing the way the world communicates.

Requisition ID:78994

Job Description:

Description

Qorvo, a part of Skyworks, is seeking a Principal Research Scientist to serve as a Principal Investigator and key individual contributor, providing technical leadership and innovation in RF-based 3D heterogeneous integration (3DHI). This role is responsible for identifying, developing, and maturing next-generation RF system-in-package (SiP), wafer-level packaging (WLP), and heterogeneous integration technologies that enable future radar, communications, and other emerging applications.

The successful candidate will be a recognized technical leader with a demonstrated track record of innovation, proposal development, funding capture, and technology transition. This individual will lead focused research initiatives, guide small multidisciplinary R&D teams, and collaborate across the organization to deliver high-impact technical outcomes. The role requires the creation of differentiated advanced packaging technologies that enable new product capabilities, accelerate technology adoption, strengthen intellectual property, and contribute directly to Skyworks' long-term commercial success and technology leadership.

Responsibilities

• Lead research and technology development in advanced microelectronics packaging, including 3D heterogeneous integration (3DHI), wafer-level packaging (WLP), and advanced RF packaging technologies.
• Develop innovative concepts, architectures, and integration approaches for RF systems, subsystems, and system-in-package (SiP) solutions.
• Evaluate emerging materials, assembly processes, packaging architectures, and manufacturing technologies to improve RF performance, miniaturization, reliability, and cost.
• Define and execute technology roadmaps aligned with business strategy, product needs, and long-term research objectives.
• Develop RF-enabled heterogeneous integration solutions incorporating semiconductor devices, advanced substrates, embedded passives, antennas, and advanced interconnect technologies.
• Lead modeling, simulation, characterization, and validation activities across device, package, and subsystem levels.
• Collaborate with cross-functional teams including design, materials, manufacturing, reliability, product engineering, and business development organizations.
• Identify, develop, and pursue externally funded research opportunities with government agencies, industry consortia, universities, national laboratories, and strategic partners.
• Serve as Principal Investigator or technical lead on sponsored research programs, ensuring successful execution of technical objectives, schedules, and deliverables.
• Publish technical papers, generate invention disclosures and patents, and present research findings at technical conferences, customer reviews, and industry forums.

Required Experience and Skills

• Ph.D. in Electrical Engineering, Materials Science, Physics, Mechanical Engineering, or a related technical discipline.
• 8+ years of industrial, government laboratory, or academic research experience in advanced microelectronics packaging, heterogeneous integration, or closely related fields.
• Demonstrated expertise in advanced package assembly, interconnect technologies, and subsystem integration.
• Proven experience leading research programs from concept development through technology demonstration, transition, or commercialization.
• Strong understanding of advanced packaging technologies, including multi-chip modules (MCM), system-in-package (SiP), wafer-level packaging (WLP), chiplet architectures, and 2.5D/3D integration.
• Demonstrated record of technical innovation through patents, peer-reviewed publications, conference presentations, and significant technology contributions.
• Experience leading multidisciplinary technical teams and collaborating effectively across organizational boundaries.
• Strong written, verbal, and presentation skills, with the ability to communicate effectively with technical, business, customer, and executive audiences.
• Demonstrated ability to develop technology strategy and influence research and development investment decisions.

Desired Experience and Skills

• Recognized industry expert in RF-enabled heterogeneous integration, advanced packaging, or related technologies.
• Experience with RF packaging solutions for microwave, mmWave, and sub-THz applications, including phased-array, radar, satellite communications, aerospace and defense, and wireless infrastructure systems.
• Deep knowledge of laminate-based packaging, organic and inorganic substrates, package-on-package (PoP), embedded component technologies, and advanced interconnect architectures.
• Experience with RF co-design across die, package, board, antenna, and system levels.
• Strong understanding of thermal, mechanical, reliability, and manufacturability considerations for advanced package development.
• Demonstrated success securing and leading externally funded research programs, including DARPA, DoW, or industry-sponsored programs.
• Experience working with semiconductor foundries, OSATs, substrate manufacturers, and advanced packaging supply chains.
• Established network within government, academic, and industry research communities.
• Significant patent portfolio and strong publication record in leading journals and conferences.
• Experience mentoring Ph.D.-level researchers and building technical capability within an R&D organization.
• Experience influencing industry roadmaps, standards, consortium activities, or strategic technology initiatives related to advanced packaging and heterogeneous integration.

The typical base pay range for this role across the U.S. is currently USD$122,900 -$255,200 per year. Starting base pay will depend on relevant experience and skills, training and education, business needs, market demands, the ultimate job duties and requirements, and work location. Skyworks has different base pay ranges for different work locations in the U.S. Benefits include access to healthcare benefits (including a premium-free medical plan option), a 401(k) plan and company match, an employee stock purchase plan, paid time off (including vacation, sick/wellness, parental leave), among others. Employees are eligible to participate in an incentive plan, and certain roles are also eligible for additional awards, including recognition and stock. These incentives and awards are based on individual and/or company performance.

Skyworks is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, age, sex, sexual orientation, gender identity, national origin, disability, protected veteran status, or any other characteristic protected by law.Skyworks strives to create an accessible workplace; if you need an accommodation due to a disability, please contact us at [e-mail].