Principal Memory Process Engineer - ALD & DRAM Innovation

Digitailor

Phoenix (AZ)

On-site

USD 180,000 - 240,000

Full time

6 days ago
Be an early applicant

Get a reply from this employer

Your resume and cover letter, tailored to exactly what they’re hiring for.

Get past ATS filters

Job summary

ASM is seeking a Principal Process Engineer focused on memory device fabrication and advanced thin-film deposition. You will drive ALD/PEALD, CVD/PECVD, and epitaxy programs for next-generation DRAM and memory technologies, shaping process challenges, materials, and integration strategies.

You will design and execute complex experiments, analyze data, and collaborate with customers and product teams to accelerate development and deployment. Publications and IP contribution are expected.

Qualifications

  • Master's or PhD in Chemical Engineering, Materials Science, Electrical Engineering, Physics, or related discipline.
  • 7+ years of combined industry, research, and/or academic experience.
  • Strong experience with ALD/PEALD, CVD/PECVD, epitaxy, oxidation, and annealing.
  • Experience with DRAM, NAND, or emerging memory device development and integration.
  • Knowledge of high-k dielectrics, metal electrodes, capacitor technologies.
  • Proficiency in materials characterization (XPS, SIMS, XRR, XRD, TEM, SEM, ellipsometry).
  • Ability to design and interpret complex experiments and DOE/RSM.

Responsibilities

  • Develop and optimize advanced deposition processes for DRAM and memory applications using ALD/PEALD, epitaxy, and PECVD technologies.
  • Drive process innovations for memory-critical films including high-k dielectrics and capacitor materials.
  • Lead DOE and RSM studies to optimize process performance and reliability.
  • Analyze electrical, physical, and materials data to understand film properties and device performance.
  • Collaborate with customers and product teams to accelerate technology development and transfers.
  • Publish technical papers and contribute to ASM’s patent portfolio; mentor engineers.

Job description

ASM is seeking a Principal Process Engineer focused on memory device fabrication and advanced thin-film deposition. You will drive ALD/PEALD, CVD/PECVD, and epitaxy programs for next-generation DRAM and memory technologies, shaping process challenges, materials, and integration strategies.

You will design and execute complex experiments, analyze data, and collaborate with customers and product teams to accelerate development and deployment. Publications and IP contribution are expected.

Get your free, confidential resume review.

or drag and drop your file here.

Similar jobs

Similar jobs worth comparing

Lead DRAM & Memory Process Engineer
Lead DRAM & Memory Process Engineer

asm • Phoenix (AZ)

On-site
USD 150,000 - 190,000
Principal Process Engineer - DRAM and Memory Applications
Principal Process Engineer - DRAM and Memory Applications

asm • Phoenix (AZ)

On-site
USD 150,000 - 190,000
Principal Process Engineer - DRAM and Memory Applications
Principal Process Engineer - DRAM and Memory Applications

Digitailor • Phoenix (AZ)

On-site
USD 180,000 - 240,000
Senior Process Engineer - Advanced Thin Films (ALD/PECVD)
Senior Process Engineer - Advanced Thin Films (ALD/PECVD)

ASM • Phoenix (AZ)

On-site
USD 110,000 - 160,000
Advanced DRAM Process Technologist
Advanced DRAM Process Technologist

IBM • City of Albany (NY)

On-site
USD 150,000 - 190,000
DRAM Process Innovation Lead
DRAM Process Innovation Lead

IBM • City of Albany (NY)

On-site
USD 150,000 - 190,000
Principal Vapor/Thermal Etch Process Engineer, DRAM
Principal Vapor/Thermal Etch Process Engineer, DRAM

Micron • Boise (ID)

On-site
USD 120,000 - 190,000
Senior DRAM Process Integration Engineer - Innovate Memory
Senior DRAM Process Integration Engineer - Innovate Memory

Micron • Boise (ID)

On-site
USD 120,000 - 150,000
DRAM Process Integration Engineer — R&D for Next-Gen Memory
DRAM Process Integration Engineer — R&D for Next-Gen Memory

Micron Technology, Inc. • Boise (ID)

On-site
USD 120,000 - 180,000
Medical, dental, and vision plans
Paid time off
Paid holidays
+1
Staff DRAM Design Engineer — AI-Driven Memory Innovation
Staff DRAM Design Engineer — AI-Driven Memory Innovation

Micron Technology, Inc • Boise (ID)

On-site
USD 120,000 - 180,000
Medical, dental and vision plans
Paid time off and holidays
Equal opportunity employer