Principal Process Engineer - DRAM and Memory Applications

asm; Phoenix (AZ); On-site; USD 150,000 - 190,000; Full time

Job summary

ASM seeks a senior engineer to advance deposition processes for DRAM and next-gen memory devices, employing ALD, PEALD, CVD/PECVD, and epitaxy. You will drive process innovation, collaborate with global customers, and design DOE/RSM experiments to optimize film properties and device performance.

You will mentor engineers, analyze electrical and materials data, and contribute to ASM's patent portfolio while helping scale processes for high-volume manufacturing.

Qualifications

• Master's or PhD in a related technical discipline.
• 7+ years of industry/research/academic experience in memory device development.
• Proven experience with ALD/PEALD/CVD/PECVD and epitaxy.

Responsibilities

• Develop and optimize advanced deposition processes for DRAM and emerging memory applications using ALD, PEALD, epitaxy, and PECVD.
• Drive process innovation for memory-critical films including high-k dielectrics, metal electrodes, barrier layers and conductors.
• Lead technical problem-solving using DOE and statistics; collaborate with customers to define requirements and support demonstrations.
• Publish technical papers, present at conferences, and contribute to ASM's patent portfolio.
• Mentor engineers and provide technical leadership across memory-focused programs.

Skills

Memory device architecture

Thin-film deposition

DOE / RSM

Electrical characterization

Process development leadership

Problem solving

Customer collaboration

Education

Master's or PhD in Chemical Engineering / Materials Science / Electrical Engineering / Physics

Tools

XPS

SIMS

RBS

AFM

XRR

XRD

TEM

SEM

Ellipsometry

Job description

Step into a career with ASM, where cutting edge technology meets collaborative culture.

For over 55 years ASM has been ahead of what's next, at the forefront of innovation and what's technologically possible. With more than 4,500 ASMers representing 70 nationalities, our people and our advanced semiconductor devices are playing a crucial role in trends such as 5G, cloud computing, AI, and autonomous driving. But we're more than just a tech company. We value diversity, inclusion and sustainability as we strive to make a positive impact on the world. Our development programs help support your growth, shaping your future and pushing the boundaries of innovation to unleash potential.

Key Responsibilities

• Develop and optimize advanced deposition processes for DRAM and emerging memory applications utilizing ALD, PEALD, Epitaxy, and PECVD technologies.
• Drive process innovation for memory-critical films, including high-k dielectrics, capacitor materials, metal electrodes, barrier layers, conductors, and emerging memory materials.
• Support technology development focused on DRAM scaling challenges such as capacitor formation, buried word lines, advanced patterning, and high-aspect-ratio structures.
• Remain at the forefront of memory technology trends and roadmaps to identify new process opportunities and technology requirements.
• Serve as a technical consultant and subject matter expert for internal teams and leading memory manufacturers worldwide.
• Lead technical problem-solving efforts using scientific methodologies, statistical analysis, and industry-standard tools.
• Design and execute experiments utilizing Design of Experiments (DOE) and Response Surface Methodology (RSM) to optimize process performance.
• Analyze electrical, physical, and materials characterization data to understand film properties and device performance.
• Troubleshoot equipment and process issues through hands‑on experimentation and root cause analysis.
• Collaborate with customers to define requirements, execute demonstrations, and develop process solutions addressing critical memory integration challenges.
• Develop methods and techniques for integrating advanced materials into future DRAM and memory device architectures.
• Support product transfers, customer demonstrations, field training, and process documentation to ensure successful deployment of new technology.
• Publish technical papers, present at industry conferences, and contribute to ASM's patent portfolio.
• Mentor engineers and provide technical leadership across memory-focused development programs.
• May provide supervisory direction to process engineering technicians and support personnel.

Qualifications

• Master's or PhD degree in Chemical Engineering, Materials Science, Electrical Engineering, Physics, or a related technical discipline.
• 7+ years of combined industry, research, and/or academic experience with:
• Advanced thin-film deposition technologies including ALD, PEALD, CVD, PECVD, Epitaxy, oxidation, and annealing.
• DRAM, NAND, or emerging memory device development and integration.
• High-k dielectrics, metal electrodes, conductive films, barrier materials, and capacitor technologies.
• Semiconductor process integration and materials engineering for advanced memory applications.
• Materials characterization techniques including XPS, SIMS, RBS, AFM, XRR, XRD, TEM, SEM, and ellipsometry.
• Strong understanding of electrical characterization techniques and memory device performance metrics.
• Experience supporting advanced memory process development for high-volume manufacturing environments is highly preferred.
• Training or experience with Computational Fluid Dynamics (CFD) is preferred.

Skills

• Deep understanding of DRAM and memory device architecture, fabrication flows, and scaling challenges.
• Demonstrated expertise in thin-film deposition and integration for advanced memory structures.
• Ability to independently lead complex process development projects, including technical direction, schedules, budg