Principal Mechanical Engineer, Thermal & Enclosures

Oracle; San Juan (PR); On-site; USD 115,000 - 235,000; Full time

Job summary

Oracle seeks a Mechanical Design Engineer to independently design and develop mechanical systems and packaging for data center and cloud products. You will use CAD tools (ProE, SolidWorks) to create 3D models, review stress/FEA, support prototype-to-production, and collaborate with cross-functional teams including operations and suppliers.

The role emphasizes manufacturability, reliability, and timely delivery, with responsibilities spanning thermal management, product testing, and collaboration

Responsibilities

• Independently designs and develops electronic parts, components, board layout and board planning, mechanical systems, equipment, and packaging, ensuring reliability, performance, and manufacturability.
• Contributes to setting thermal cooling strategies and designs mechanical architecture for server generations, from feasibility studies to production.
• Utilizes CAD tools to develop 3D models and detailed mechanical designs, collaborating with cross-functional teams to refine solutions.
• Reviews stress analysis, strain analysis, and Finite Element Analysis (FEA) to evaluate mechanical strength and reliability.

Job description

Oracle seeks a Mechanical Design Engineer to independently design and develop mechanical systems and packaging for data center and cloud products. You will use CAD tools (ProE, SolidWorks) to create 3D models, review stress/FEA, support prototype-to-production, and collaborate with cross-functional teams including operations and suppliers.

The role emphasizes manufacturability, reliability, and timely delivery, with responsibilities spanning thermal management, product testing, and collaboration