Principal HBM Design Architect

1000 Micron Technology, Inc.

Richardson (TX)

On-site

USD 120,000 - 180,000

Full time

14 days+
Application generator

Stand out for this role — generate a tailored resume and cover letter in about a minute.

Get past ATS filters

Benefits offered by this job

Medical insurance
Dental plan
Paid time off
Paid holidays
Income protection

Job summary

Micron Technology, Inc. in Richardson, TX is seeking an HBM Memory Design Engineer to design, simulate, and optimize digital and analog DRAM circuits used in advanced HBM technology.

You will evaluate block-level functionality, perform timing analyses, and contribute to architecture studies for future high-bandwidth memory solutions. Minimum qualifications include a BSEE with 7+ years (or MSEE with 5+ years) in circuit design, strong CMOS knowledge, and experience with HSPICE/FineSim and

Qualifications

  • BSEE with 7+ years or MSEE with 5+ years in circuit design.
  • Strong CMOS circuit design knowledge and device physics.
  • Experience with HSPICE/FineSim and scripting (Python/Tcl/Perl).

Responsibilities

  • Design, simulate, and optimize digital and analog DRAM circuits including data path, ECC, command/control, and high-speed timing structures.
  • Evaluate full-chip and block-level functionality and propose solutions to achieve correct circuit and system behavior.
  • Perform timing, area, power, and complexity analysis for high-speed DRAM and mixed-signal circuits.
  • Conduct pathfinding studies and feasibility analyses for future HBM architectures.
  • Contribute to the development, layout, and optimization of memory, logic, and analog circuits.
  • Analyze circuit behavior under varying PVT and parasitic conditions to ensure robust operation.
  • Collaborate with multi-functional teams across build, verification, product engineering, process, and packaging.
  • Support design reviews, documentation, and continuous improvement of design methodologies.

Skills

CMOS circuit design
HSPICE / FineSim
Python scripting
Power distribution analysis
Schematic entry
Device physics

Education

BSEE
MSEE

Tools

HSPICE
FineSim

Job description

Overview

As an HBM Memory Design Engineer in Micron’s HBM Architecture Team, you will design, simulate, analyze, and floorplan digital and analog DRAM circuits used in advanced HBM technology. You will evaluate block-level and full-chip functionality, perform architectural pathfinding, and contribute to the development of next‑generation high‑bandwidth DRAM solutions.

Responsibilities
  • Design, simulate, and optimize digital and analog DRAM circuits including data path, ECC, command/control, and high‑speed timing structures.
  • Evaluate full‑chip and block‑level functionality and propose solutions to achieve correct circuit and system behavior.
  • Perform timing, area, power, and complexity analysis for high‑speed DRAM and mixed‑signal circuits.
  • Conduct pathfinding studies and feasibility analyses for future HBM architectures.
  • Contribute to the development, layout, and optimization of memory, logic, and analog circuits.
  • Analyze circuit behavior under varying PVT and parasitic conditions to ensure robust operation.
  • Collaborate with multi‑functional teams across build, verification, product engineering, process, and packaging.
  • Support design reviews, documentation, and continuous improvement of design methodologies.
Minimum Qualifications
  • BSEE with 7+ years, or MSEE with 5+ years of relevant circuit design experience.
  • Strong understanding of CMOS circuit design and device physics.
  • Experience with schematic entry and simulation using HSPICE, FineSim, or equivalent.
  • Experience with power distribution and network analysis.
  • Proficiency with scripting languages such as Python, Tcl, or Perl.
Preferred Qualifications
  • Familiarity with DRAM, memory subsystem design, or high‑speed interface circuits.
  • Strong analytical and problem‑solving skills.
  • Ability to communicate complex technical concepts effectively across teams.
Benefits

Micron offers a range of benefits, including medical, dental, and vision plans, income protection programs, paid family leave, a robust paid time‑off program, and paid holidays.

Equal Opportunity Employment

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.

Get your free, confidential resume review.
or drag and drop your file here.
Similar jobs

Similar jobs worth comparing

Principal HBM Design Architect
Principal HBM Design Architect

Micron Technology, Inc • Richardson (TX)

On-site
USD 120,000 - 160,000
Medical insurance
Dental insurance
Vision insurance
+3
Principal HBM Design Architect
Principal HBM Design Architect

1000 Micron Technology, Inc. • Folsom (CA)

On-site
USD 130,000 - 180,000
Medical, dental, and vision plans
Income protection
Paid family leave
+2
Staff HBM Design Architect
Staff HBM Design Architect

Micron Technology • Richardson (TX)

On-site
USD 146,000 - 297,000
Medical, dental and vision plans
Paid family leave
Robust paid time-off
+1
Staff HBM Design Architect
Staff HBM Design Architect

1000 Micron Technology, Inc. • Richardson (TX)

On-site
USD 146,000 - 297,000
Medical, dental, and vision plans
Income protection
Paid family leave
+2
Staff HBM Design Architect
Staff HBM Design Architect

Micron Technology • Folsom (CA)

On-site
USD 146,000 - 297,000
Medical, dental, and vision plans
Paid family leave
Robust paid time-off
+1
Staff HBM Design Architect
Staff HBM Design Architect

Micron Technology, Inc • Richardson (TX)

On-site
USD 146,000 - 297,000
Paid family leave
Robust paid time-off program
Paid holidays
Memory Design Engineer, HBM
Memory Design Engineer, HBM

1000 Micron Technology, Inc. • Richardson (TX)

On-site
USD 80,000 - 110,000
Medical, dental, and vision plans
Paid family leave
Robust paid time-off program
Principal Memory Design Engineer, HBM
Principal Memory Design Engineer, HBM

1000 Micron Technology, Inc. • Richardson (TX)

On-site
USD 110,000 - 145,000
Medical, dental, and vision plans
Income protection
Paid family leave
+1
Principal Memory Design Engineer, HBM
Principal Memory Design Engineer, HBM

Micron Technology, Inc • Richardson (TX)

On-site
USD 120,000 - 150,000
Robust paid time-off program
Paid family leave
Income protection programs
Memory Design Engineer, HBM
Memory Design Engineer, HBM

Micron Technology, Inc • Richardson (TX)

On-site
USD 80,000 - 100,000
Choice of medical, dental, and vision plans
Paid family leave
Robust paid time-off program and paid holidays