Memory Design Engineer, HBM

Micron Technology, Inc; Richardson (TX); On-site; USD 80,000 - 100,000; Full time

Benefits offered by this job

Choice of medical, dental, and vision plans

Paid family leave

Robust paid time-off program and paid holidays

Job summary

Micron Technology, Inc. is seeking a Memory Design Engineer responsible for designing and analyzing circuits used in memory products. You will collaborate globally with various departments to ensure manufacturable, high-quality solutions that optimize cost and reliability.

Qualifications include a BS or MS in Electrical Engineering and proficiency in CMOS Circuit Design, VLSI, and tools such as Cadence Virtuoso. This role offers competitive benefits including medical, dental, and vision plans.

Qualifications

• Proficiency with Cadence Virtuoso, and experience simulating with FINESIM, HSPICE, and VERILOG.
• Strong analytical and problem‑solving skills with validated significant technical contributions.
• Expertise in DRAM subsystem architecture, specification, operation, or design.

Responsibilities

• Design digital, analog, and memory core circuits using CMOS logic and transistors.
• Create optimized floorplans for circuit placement, routing, and power delivery.
• Conduct circuit simulations and analyze power, performance, reliability, and parasitic impacts.

Skills

CMOS Circuit Design

VLSI

Analog Circuit Design

Cadence Virtuoso

DRAM subsystem architecture

Analytical skills

Education

BS or MS in Electrical Engineering or related field

Tools

FINESIM

HSPICE

VERILOG

Job description

Req ID: JR91774 Memory Design Engineer, HBM

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

As a Design Engineer at Micron Technology, Inc., you will be responsible for designing and analyzing digital and analog circuits used in the development of memory products. You will collaborate with Micron’s various design and verification teams around the world and support the efforts of groups such as Product Engineering, Test, Probe, Process Integration, Assembly and Marketing to proactively design products that optimize all manufacturing functions and assure the best cost, quality, reliability, time‑to‑market, and customer satisfaction.

The Design Engineer is responsible for designing, simulating, and optimizing DRAM circuits while supporting the development of digital and analog circuitry used in advanced memory products. This role collaborates globally across design, verification, product engineering, test, probe, process integration, assembly, and marketing to ensure manufacturable, high‑quality, cost‑optimized solutions. The position drives innovation in future memory generations and supplies to silicon‑to‑system development in a dynamic engineering environment.

Responsibilities

• Design digital, analog, and memory core circuits using CMOS logic and transistors, implementing device specifications from concept to solution.
• Create optimized floorplans for circuit placement, routing, power delivery, sense margins, array timing, and die size, including layout leadership.
• Conduct circuit simulations using FINESIM, HSPICE, and VERILOG; analyze power, performance, reliability, and parasitic impacts.
• Validate builds through reticle experiments, tape‑out revisions, and simulation‑to‑silicon correlation, identifying required schematic edits.
• Prepare and maintain design documentation while giving best‑known practices and departmental training.
• Collaborate with global build, verification, product engineering, test, probe, process integration, assembly, and marketing teams to ensure manufacturability and quality.
• Lead layout and develop resources, track project tasks, and serve as the point of contact for design, layout, verification, and test issues.
• Prepare project status reports and lead design reviews to communicate progress and technical decisions.

Minimum Qualifications

• Coursework in CMOS Circuit Design, VLSI, and Analog Circuit Design, with understanding of device reliability and circuit floor planning.
• Proficiency with Cadence Virtuoso, and experience simulating with FINESIM, HSPICE, and VERILOG.
• Strong analytical and problem‑solving skills with validated significant technical contributions and a record of innovation.
• Expertise in DRAM subsystem architecture, specification, operation, or design, including cross‑department technical leadership experience.
• Ability to proactively collaborate across multiple engineering organizations to optimize manufacturing quality, cost, reliability, and time‑to‑market.

Preferred Qualifications

• Self‑motivated with strong problem‑solving abilities and an aim to discover new solutions.
• Deep knowledge of industry‑specific technologies and competitive trends.
• Excellent communication and interpersonal skills for multi‑functional collaboration.
• BS or MS in Electrical Engineering or related field plus 3 years of experience in DRAM design, product, or system.

Job Profile(s): Semiconductor Design Engineer 2 - Semiconductor Design Engineer 3

Relocation Level: TBD

Benefits

• Choice of medical, dental, and vision plans available in all locations, enabling team members to select the plans that best meet their family healthcare needs and budget.
• Benefit programs that help protect income if unable to work due to illness or injury.
• Paid family leave.
• Robust paid time‑off program and paid holidays.

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.