Memory Design Engineer, HBM

1000 Micron Technology, Inc.; Richardson (TX); On-site; USD 80,000 - 110,000; Full time

Benefits offered by this job

Medical, dental, and vision plans

Paid family leave

Robust paid time-off program

Job summary

Micron Technology, Inc. is looking for a Design Engineer to design and analyze digital and analog circuits for memory products. Collaborating with global teams, you will ensure optimal production functions and customer satisfaction.

The ideal candidate has experience in CMOS designs, strong problem-solving skills, and preferably a BS or MS in Electrical Engineering. This role offers comprehensive benefits and a collaborative work environment.

Qualifications

• Coursework in CMOS Circuit Design, VLSI, and Analog Circuit Design.
• Proficiency with Cadence Virtuoso.
• Strong analytical and problem‑solving skills required.
• Expertise in DRAM subsystem architecture.
• Ability to collaborate across multiple engineering organizations.

Responsibilities

• Design digital, analog, and memory core circuits using CMOS logic.
• Conduct circuit simulations using FINESIM, HSPICE, and VERILOG.
• Collaborate with various teams to ensure manufacturability and quality.
• Prepare and maintain design documentation.
• Lead layout and develop project resources.

Skills

CMOS Circuit Design

VLSI

Analog Circuit Design

Cadence Virtuoso

FINESIM

HSPICE

VERILOG

DRAM subsystem architecture

Analytical skills

Problem-solving skills

Education

BS or MS in Electrical Engineering or related field

Tools

Cadence Virtuoso

FINESIM

HSPICE

VERILOG

Job description

As a Design Engineer at Micron Technology, Inc., you will be responsible for designing and analyzing digital and analog circuits used in the development of memory products. You will collaborate with Micron’s various design and verification teams worldwide and support the efforts of groups such as Product Engineering, Test, Probe, Process Integration, Assembly, and Marketing to proactively design products that optimize manufacturing functions and assure the best cost, quality, reliability, time‑to‑market, and customer satisfaction.

Responsibilities

• Design digital, analog, and memory core circuits using CMOS logic and transistors, implementing device specifications from concept to solution.
• Create optimized floorplans for circuit placement, routing, power delivery, sense margins, array timing, and die size, including layout leadership.
• Conduct circuit simulations using FINESIM, HSPICE, and VERILOG; analyze power, performance, reliability, and parasitic impacts.
• Validate builds through reticle experiments, tape‑out revisions, and simulation‑to‑silicon correlation, identifying required schematic edits.
• Prepare and maintain design documentation while ensuring best‑known practices and departmental training.
• Collaborate with global build, verification, product engineering, test, probe, process integration, assembly, and marketing teams to ensure manufacturability and quality.
• Lead layout and develop resources, track project tasks, and serve as the point of contact for design, layout, verification, and test issues.
• Prepare project status reports and lead design reviews to communicate progress and technical decisions.

Minimum Qualifications

• Coursework in CMOS Circuit Design, VLSI, and Analog Circuit Design, with understanding of device reliability and circuit floor planning.
• Proficiency with Cadence Virtuoso, and experience simulating with FINESIM, HSPICE, and VERILOG.
• Strong analytical and problem‑solving skills with validated significant technical contributions and a record of innovation.
• Expertise in DRAM subsystem architecture, specification, operation, or design, including cross‑department technical leadership experience.
• Ability to proactively collaborate across multiple engineering organizations to optimize manufacturing quality, cost, reliability, and time‑to‑market.

Preferred Qualifications

• Self‑motivated with strong problem‑solving abilities and an aim to discover new solutions.
• Deep knowledge of industry‑specific technologies and competitive trends.
• Excellent communication and interpersonal skills for multi‑functional collaboration.
• BS or MS in Electrical Engineering or related field plus 3 years of experience in DRAM design, product, or system.

Benefits

• Choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget.
• Benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave.
• Robust paid time‑off program and paid holidays.

Equal Opportunity & EEO

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.