Principal ASIC Package Design Engineer

K2 Space; Seattle (WA); Hybrid; USD 200,000 - 280,000; Full time

Benefits offered by this job

Comprehensive benefits

Job summary

K2 Space is seeking a Principal ASIC Package Design Engineer to lead FC-BGA and MCM packaging for high-performance mixed-signal and digital SoCs. You will drive end-to-end package strategy, engage with vendors, and define standards to ensure first-pass success for power-dense ASICs.

Join a fast-growing, Series D-funded space tech company with a hybrid in-office requirement (3 days/week) and travel to our Torrance, CA HQ.

Qualifications

• Bachelor's degree in Packaging, Mechanical, or Electrical Engineering or related field.
• 10+ years of ASIC package design experience with deep FC-BGA expertise.
• Strong understanding of substrate technologies, SI/PI fundamentals at package level, and thermal management.

Responsibilities

• Own ASIC package architecture for FC-BGA and MCM solutions, including substrate stack-up, ball-map strategy, power delivery, signal breakout, and mechanical constraints.
• Lead package-level trade studies across cost, performance, PI, SI, thermal, manufacturability, and reliability.
• Define long-term packaging roadmap aligned with future ASIC nodes, bandwidth scaling, and multi-die integration.
• Establish organizational package design standards, methodologies, and best practices.
• Drive detailed design of FC-BGA packages for high-pin-count ASICs with high-speed SerDes, dense power grids, and RF signal content.

Skills

FC-BGA

MCM

Thermal management

Si/PI simulation

OSAT coordination

Education

Bachelor's degree in Packaging Engineering / EE / ME

Tools

SIWave

HFSS

ADS

Job description

K2 is building the largest and highest-power satellites ever flown, unlocking performance levels previously out of reach across every orbit. Backed by over $1 billion in total funding from leading investors including Altimeter Capital, ICONIQ, Kleiner Perkins, Lightspeed Venture Partners, Redpoint Ventures, and T. Rowe Price — and with over $1 billion in signed contracts across commercial and US government customers, we're mass-producing the highest-power satellite platforms ever built for missions from LEO to deep space.

The rise of heavy-lift launch vehicles is shifting the industry from an era of mass constraint to one of mass abundance, and we believe this new era demands a fundamentally different class of spacecraft. Engineered to survive the harshest radiation environments and to fully capitalize on today's and tomorrow's massive rockets, K2 satellites deliver unmatched capability at constellation scale and across multiple orbits.

With multiple launches in 2027 and plans to scale to 100 satellites a year, we're Building Bigger — helping develop the solar system and build toward a Kardashev Type II (K2) civilization. If you are a motivated individual who thrives in a fast-paced environment and you're excited about contributing to the success of a high-growth Series D-funded company, we'd love for you to apply.

The Role

We are seeking a PrincipalASICPackage Design Engineer to lead advanced ASIC package architecture and execution, with a strong focus on flip-chip BGA (FC-BGA) and multi-chip module (MCM) solutions. This role owns the end-to-end package strategy for high-performance mixed-signal and digital SoCsfrom early architecture and trade studies through vendor engagement, qualification, and production ramp. You willoperateas the technical authority for package design, defining standards, influencing silicon and system architecture, and ensuring first-pass success for complex, high-speed, power-dense ASICs.

Responsibilities

• Own ASIC package architecture for FC-BGA and MCM solutions, including substrate stack-up, ball-map strategy, power delivery, signal breakout, and mechanical constraints.
• Lead package-level trade studies across cost, performance, power integrity (PI), signal integrity (SI), thermal, manufacturability, and reliability.
• Define long-term packaging roadmap aligned with future ASIC nodes, bandwidth scaling, and multi-die integration.
• Establish organizational package design standards, methodologies, and best practices.
• Drive detailed design of FC-BGA packages for high-pin-count ASICs with high-speed SerDes, dense power grids, andRF signalcontent.
• Define and review substrate stack-ups, via strategies, impedance control, escape routing, and reference plane planning.
• Partner with silicon, RF, and systems teams to co-optimizedie floorplans and package interfaces.
• Own package-level SI/PI strategy, includinghigh-speed digital interfaces (e.g., SerDes, JESD, Interlaken), power delivery network (PDN) design,and decoupling strategy
• Lead thermal architecture at the package level, including lidselection, TIMs, heat-spreaders, and mechanical interfaces to system cooling.
• Manage relationships with external packaging vendors, substrate suppliers, and
• OSATs, including vendor qualification, capability assessment, contract negotiation, and performance/quality score carding to ensure roadmap and volume commitments aremet.
• Drive material selection, substrate technology choices, and assembly process optimization.

RequiredQualifications

• Bachelor’s degree in Packaging Engineering, Mechanical Engineering, Electrical Engineering, or a related field.
• 10+ years of experience in ASIC package design, with deepexpertisein FC-BGA.
• Strong understanding ofsubstrate technologies and materials,SI/PI fundamentals at the package level, and thermal management for power-dense ASICs.
• Fluent in SI/PI and EM simulation tools such asSIWave, HFSS, and ADS.
• Experience working directly with OSATs and substrate vendors.
• Knowledge of packaging qualification and test methodologies.

Preferred Qualifications

• Experience with MCM or heterogeneous integration (chiplets, interposers, advanced laminates).
• Background in high-speed digital or mixed-signal SoCs.
• Familiarity with aerospace, space, or high-reliability electronics.
• Experience defining packaging strategy from early architecture through first silicon and volume ramp.
• Demonstrated history of building or scaling package designmethodologywithin an organization.

Compensation and Benefits:

• Base salary range for this role is $200,000 – $280,000 + equity in the company
• Salary will be based on several factors including, but not limited to: knowledge and skills, education, and experience level
• Comprehensive benefits package including paid time off, medical/dental/vision/ coverage, life insurance, paid parental leave, and many other perks

If you don’t meet 100% of the preferred skills and experience, we encourage you to still apply! Building a spacecraft unlike any other requires a team unlike any other and non-traditional career twists and turns are encouraged!

If you need a reasonable accommodation as part of your application for employment or interviews with us, please let us know.

Export Compliance

As defined in the ITAR, “U.S. Persons” include U.S. citizens, lawful permanent residents (i.e., Green Card holders), and certain protected individuals (e.g., refugees/asylees, American Samoans). Please consult with a knowledgeable advisor if you are unsure whether you are a “U.S. Person.”

The person hired for this role will have access to information and items controlled by U.S. export control regulations, including the export control regulations outlined in the International Traffic in Arms Regulation (ITAR). The person hired for this role must therefore either be a “U.S. person” as defined by 22 C.F.R. § 120.15 or otherwise eligible for a federally issued export control license.

K2 Space is an Equal Opportunity Employer; employment with K2 Space is governed on the basis of merit, competence and qualifications and will not be influenced in any manner by race, color, religion, gender, national origin/ethnicity, veteran status, disability status, age, sexual orientation, gender identity, marital status, mental or physical disability or any other legally protected status.

Create a Job Alert

Interested in building your career at K2 Space ? Get future opportunities sent straight to your email.

Accepted file types: pdf, doc, docx, txt, rtf

Enter manually

Accepted file types: pdf, doc, docx, txt, rtf

Education

School * Select...

Degree * Select...

Select...

Start date year

End date year

LinkedIn profile

How did you hear about this job? *

We value in-person collaboration, and this role requires in-office presence 3 days per week with periodic travel to K2's headquarters in Torrance, CA. Are you able to support this hybrid expectation? * Select...

What is your ideal start date? *

What are your base salary expectations? *

Active Security Clearance(s) * Select...

Are you legally authorized to work in the United States? * Select...

Select...

To conform to U.S. Government space technology export regulations, including the International Traffic in Arms Regulations (ITAR) you must be a U.S. citizen, lawful permanent resident of the U.S., protected individual as defined by 8 U.S.C. 1324b(a)(3), or eligible to obtain the required authorizations from the U.S. Department of State. Learn more about ITAR here .

If Other, please explain:

Voluntary Self-Identification

For government reporting purposes, we ask candidates to respond to the below self-identification survey.Completion of the form is entirely voluntary. Whatever your decision, it will not be considered in the hiringprocess or thereafter. Any information that you do provide will be recorded and maintained in aconfidential file.

As set forth in K2 Space ’s Equal Employment Opportunity policy,we do not discriminate on the basis of any protected group status under any applicable law.

If you believe you belong to any of the categories of protected veterans listed below, please indicate by making the appropriate selection.As a government contractor subject to the Vietnam Era Veterans Readjustment Assistance Act (VEVRAA), we request this information in order to measurethe effectiveness of the outreach and positive recruitment efforts we undertake pursuant to VEVRAA. Classification of protected categoriesis as follows:

A "disabled veteran" is one of the following: a veteran of the U.S. military, ground, naval or air service who is entitled to compensation (or who but for the receipt of military retired pay would be entitled to compensation) under laws administered by the Secretary of Veterans Affairs; or a person who was discharged or released from active duty because of a service-connected disability.

A "recently separated veteran" means any veteran during the three-year period beginning on the date of such veteran's discharge or release from active duty in the U.S. military, ground, naval, or air service.

An "active duty wartime or campaign badge veteran" means a veteran who served on active duty in the U.S. military, ground, naval or air service during a war, or in a campaign or expedition for which a campaign badge has been authorized under the laws administered by the Department of Defense.

An "Armed forces service medal veteran" means a veteran who, while serving on active duty in the U.S. military, ground, naval or air service, participated in a United States military operation for which an Armed Forces service medal was awarded pursuant to Executive Order 12985.

Select...

Voluntary Self-Identification of Disability

Form CC-305

Page 1 of 1

OMB Control Number 1250-0005

Expires 07/31/2029

Voluntary Self-Identification of Disability

Form CC-305 Page 1 of 1 OMB Control Number 1250-0005 Expires 07/31/2029
Why are you being asked to complete this form?

We are a federal contractor or subcontractor. The law requires us to provide equal employment opportunity to qualified people with disabilities. We have a goal of having at least 7% of our workers as people with disabilities. The law says we must measure our progress towards this goal. To do this, we must ask applicants and employees if they have a disability or have ever had one. People can become disabled, so we need to ask this question at least every five years.

Completing this form is voluntary, and we hope that you will choose to do so. Your answer is confidential. No one who makes hiring decisions will see it. Your decision to complete the form and your answer will not harm you in any way. If you want to learn more about the law or this form, visit the U.S. Department of Labor’s Office of Federal Contract Compliance Programs (OFCCP) website at www.dol.gov/ofccp .

How do you know if you have a disability?

A disability is a condition that substantially limits one or more of your “major life activities.” If you have or have ever had such a condition, you are a person with a disability. Disabilities include, but are not limited to:

• Alcohol or other substance use disorder (not currently using drugs illegally)
• Autoimmune disorder, for example, lupus, fibromyalgia, rheumatoid arthritis, HIV/AIDS
• Blind or low vision
• Cancer (past or present)
• Cardiovascular or heart disease
• Celiac disease
• Cerebral palsy
• Deaf or serious difficulty hearing
• Diabetes
• Disfigurement, for example, disfigurement caused by burns, wounds, accidents, or congenital disorders
• Epilepsy or other seizure disorder
• Gastrointestinal disorders, for example, Crohn's Disease, irritable bowel syndrome
• Intellectual or developmental disability
• Mental health conditions, for example, depression, bipolar disorder, anxiety disorder, schizophrenia, PTSD
• Missing limbs or partially missing limbs
• Mobility impairment, benefiting from the use of a wheelchair, scooter, walker, leg brace(s) and/or other supports
• Nervous system condition, for example, migraine headaches, Parkinson’s disease, multiple sclerosis (MS)
• Neurodivergence, for example, attention-deficit/hyperactivity disorder (ADHD), autism spectrum disorder, dyslexia, dyspraxia, other learning disabilities
• Partial or complete paralysis (any cause)
• Pulmonary or respiratory conditions, for example, tuberculosis, asthma, emphysema
• Short stature (dwarfism)
• Traumatic brain injury

Disability Status Select...

PUBLIC BURDEN STATEMENT: According to the Paperwork Reduction Act of 1995 no persons are required to respond to a collection of information unless such collection displays a valid OMB control number. This survey should take about 5 minutes to complete.