Precision Microelectronics Wire Bonding Tech

Anduril Industries; New Jersey; On-site; USD 41,000 - 51,000; Full time

Benefits offered by this job

Equity grants

Benefits package

Job summary

Anduril Industries is seeking a Wire Bonding Operator to perform complex bonding on microelectronic substrates and support assembly tasks in a highly controlled environment. The role requires precise manual dexterity, the ability to read detailed build sheets and ICDs, and adherence to ESD and cleanroom protocols.

Candidates should have hands-on experience with wire bonding and microelectronic manufacturing, with a focus on quality and throughput. U.S.

Qualifications

• High School Diploma or equivalent required; hands-on wire bonding or microelectronic manufacturing experience, or related bootcamp/certification.
• Proven proficiency in wire bonding techniques (manual, semi-automatic, automated) and microelectronic assembly.
• Exceptional manual dexterity and ability to work under a microscope for an entire shift.
• Strong ability to read and follow build sheets, ICDs, and engineering drawings; maintain clean, safe, ESD-compliant environment.
• U.S. Person required due to access to export-controlled information or facilities.

Responsibilities

• Execute complex wire bonding operations using various equipment and bonders on multiple substrates.
• Perform microelectronic assembly with adhesives and epoxy applications.
• Interpret detailed technical documentation and engineering drawings with high accuracy.
• Set up, calibrate, and optimize wire bonding machinery to improve bond quality and throughput.
• Conduct in-process and final inspections using reticle, indicator, microscope, and bond puller.

Skills

Wire bonding

Microelectronic assembly

Reading technical docs

ESD compliance

Education

High School Diploma or equivalent

Tools

Westbond wire bonder

Bonding equipment

Job description

Anduril Industries is seeking a Wire Bonding Operator to perform complex bonding on microelectronic substrates and support assembly tasks in a highly controlled environment. The role requires precise manual dexterity, the ability to read detailed build sheets and ICDs, and adherence to ESD and cleanroom protocols.

Candidates should have hands-on experience with wire bonding and microelectronic manufacturing, with a focus on quality and throughput. U.S.