Precision Wire Bonding Tech — Semiconductor Manufacturing

Microchip Technology Inc.; Lowell (MA); In loco; USD 31.000 - 48.000; Tempo pieno

Vantaggi offerti da questo lavoro

Health benefits

RSU program

Quarterly bonus

ESPP program

Retirement plan

Descrizione del lavoro

Microchip Technology Inc. is seeking a skilled wire bond technician to join our RF transistor packaging team.

You will set up and operate automatic and semi-automatic wire bonders, interpret technical drawings, and ensure product quality through bond testing and process optimization. The role requires 2–5 years in semiconductor manufacturing, strong manual dexterity, and the ability to work independently in a fast-paced environment.

Competenze

• Trade school or vocational school certification in electronics, manufacturing, or a related field.
• 2–5 years of hands‑on experience in semiconductor or microelectronics manufacturing
• Strong technical aptitude with demonstrated competency in artisan / craftsman processes
• Ability to work independently ensuring product requirement translation for an optimized process set‑up
• Strong attention to detail and manual dexterity
• Ability to read schematics and technical documentation
• Proficient computer skills required to access and interpret engineering drawings, and work instructions

Mansioni

• Perform component wire bonding for RF transistor packaged devices using automatic and semi-automatic wire bonders;
• conduct bond pull testing to verify bond integrity;
• Set up, calibrate, and operate multiple wire bonding and test systems concurrently, managing workflow to meet production targets and product specifications;
• Interpret engineering drawings, build sheets, and process documentation to accurately execute manufacturing tasks;
• Execute production work with a high level of precision, maintaining consistent quality and throughput;
• Independently adjust equipment and process parameters, including loop height and bond placement, to optimize performance and product quality;
• Collaborate with test technicians and engineering personnel to refine wire bonding processes and establish optimal operating conditions;
• Perform rework, repair, and modification of assemblies, including solder component removal and replacement;
• Troubleshoot production and equipment issues, documenting and escalating as needed to support timely resolution and continuous process improvement;
• Maintain accurate production records and ensure compliance with quality and manufacturing standards.

Conoscenze

Attention to detail

Manual dexterity

Read schematics

Independent worker

Technical aptitude

Schematic reading

Formazione

Trade school or vocational certification in electronics/manufacturing

Strumenti

Wire bonding equipment

Test systems

Descrizione del lavoro

Microchip Technology Inc. is seeking a skilled wire bond technician to join our RF transistor packaging team.

You will set up and operate automatic and semi-automatic wire bonders, interpret technical drawings, and ensure product quality through bond testing and process optimization. The role requires 2–5 years in semiconductor manufacturing, strong manual dexterity, and the ability to work independently in a fast-paced environment.