Micro-electronics Technician

Anduril Industries; New Jersey; On-site; USD 41,000 - 51,000; Full time

Benefits offered by this job

Equity grants

Benefits package

Job summary

Anduril Industries is seeking a Wire Bonding Operator to perform complex bonding on microelectronic substrates and support assembly tasks in a highly controlled environment. The role requires precise manual dexterity, the ability to read detailed build sheets and ICDs, and adherence to ESD and cleanroom protocols.

Candidates should have hands-on experience with wire bonding and microelectronic manufacturing, with a focus on quality and throughput. U.S.

Qualifications

• High School Diploma or equivalent required; hands-on wire bonding or microelectronic manufacturing experience, or related bootcamp/certification.
• Proven proficiency in wire bonding techniques (manual, semi-automatic, automated) and microelectronic assembly.
• Exceptional manual dexterity and ability to work under a microscope for an entire shift.
• Strong ability to read and follow build sheets, ICDs, and engineering drawings; maintain clean, safe, ESD-compliant environment.
• U.S. Person required due to access to export-controlled information or facilities.

Responsibilities

• Execute complex wire bonding operations using various equipment and bonders on multiple substrates.
• Perform microelectronic assembly with adhesives and epoxy applications.
• Interpret detailed technical documentation and engineering drawings with high accuracy.
• Set up, calibrate, and optimize wire bonding machinery to improve bond quality and throughput.
• Conduct in-process and final inspections using reticle, indicator, microscope, and bond puller.

Skills

Wire bonding

Microelectronic assembly

Reading technical docs

ESD compliance

Education

High School Diploma or equivalent

Tools

Westbond wire bonder

Bonding equipment

Job description

Anduril Industries is a defense technology company with a mission to transform U.S. and allied military capabilities with advanced technology. By bringing the expertise, technology, and business model of the 21st century’s most innovative companies to the defense industry, Anduril is changing how military systems are designed, built and sold. Anduril’s family of systems is powered by Lattice OS, an AI-powered operating system that turns thousands of data streams into a realtime, 3D command and control center. As the world enters an era of strategic competition, Anduril is committed to bringing cutting-edge autonomy, AI, computer vision, sensor fusion, and networking technology to the military in months, not years.

ABOUT THE TEAM

Advanced Infrared Solutions (AIRS), formerly American Infrared Solutions, was acquired by Anduril Industries in 2025 and now operates as part of the Imaging Business Line. For more than 10 years, AIRS has designed and built world-class, high-performance cooled infrared cameras and subsystems, including critical components such as Integrated Dewar Cooler Assemblies (IDCAs). From its site in Hudson, NH, AIRS is expanding to supply these critical components both internally, to Anduril's Imaging products, and externally, to serve as a merchant supplier to the broader defense, space, and commercial industrial base. Growing the external merchant supplier business alongside internal production is a core strategic priority for the Business Line.

WHAT YOU'LL DO:

• Execute Complex Wire Bonding Operations: Operate and maintain a variety of wire bonding equipment, including manual, semi-automatic, and automated bonders (e.g., Westbond), to perform precise gold ball, wedge, ribbon, alloy, and manganin wire bonding (e.g., 0.001" diameter) onto various substrates such as duroid and ceramic, capacitors, resistors, diodes, and spirals.
• Perform Microelectronic Assembly: Conduct intricate assembly tasks, including the careful mixing and application of various adhesives, glues, and epoxies, and the integration of micro-electronic components such as temperature diodes, capacitors, and alumina materials.
• Interpret Technical Documentation: Accurately read and interpret detailed build sheets, Interface Control Documents (ICDs), and engineering drawings, ensuring meticulous adherence to complex specifications and process requirements.
• Equipment Setup and Optimization: Independently perform setup, calibration, and make minor adjustments to wire bonding machinery, optimizing parameters such as loop heights to achieve superior bond quality and throughput.
• Quality Assurance and Inspection: Conduct rigorous in-process and final inspections, utilizing measurement equipment (e.g., reticle, indicator, microscope, bond puller) to verify bond quality and ensure full compliance with design specifications and quality standards.
• Troubleshooting and Collaboration: Work effectively with technicians, engineers, and other technical personnel to identify, analyze, and resolve technical problems encountered during production, contributing to process improvements and parameter optimization.
• Maintain Production Standards: Consistently meet high standards for quality, consistency, and work rate while strictly adhering to all cleanroom protocols, safety guidelines, and ESD procedures to maintain a safe and efficient work environment.

REQUIRED QUALIFICATIONS:

• High School Diploma or equivalent. Candidates should possess hands-on experience in wire bonding or microelectronic manufacturing OR demonstrate equivalent practical skills gained from a technical bootcamp or certification program in a related field.
• Proven proficiency in various wire bonding techniques (manual gold ball, wedge, ribbon; semi-automatic; automated) and intricate microelectronic assembly, including precise adhesive and epoxy application.
• Exceptional manual dexterity and the ability to work consistently and accurately under a microscope for an entire shift.
• Strong ability to read, interpret, and follow detailed technical documentation such as build sheets, ICDs, and engineering drawings, coupled with a commitment to maintaining a clean, safe, and ESD-compliant work environment.
• Must be a U.S. Person due to required access to U.S. export controlled information or facilities

US Salary Range: $30—$37 USD

The salary range for this role is an estimate based on a wide range of compensation factors, inclusive of base salary only. Actual salary offer may vary based on (but not limited to) work experience, education and/or training, critical skills, and/or business considerations. Highly competitive equity grants are included in the majority of full time offers; and are considered part of Anduril's total compensation package. Additionally, Anduril offers top-tier benefits for full-time employees, including:

Benefits

At Anduril, we invest in our people. Our comprehensive, competitive benefits package (available at little to no cost to employees) ensures you’re supported in health, recovery, and whatever comes next. For more information, Explore Our Benefits.

Data Privacy

To view Anduril's candidate data privacy policy, please visit https://anduril.com/applicant-privacy-notice/.

By submitting your application, you consent to Anduril Industries using a third-party service provider to conduct pre-employment risk, integrity, and due diligence screening and assessing potential risks as part of your application process. This third-party service provider provides risk-intelligence services that may include analysis of sanctions and watchlists, adverse media, public-record information, and other lawful open-source or commercial data sources. This third-party service provider does not act as a consumer reporting agency. Use of this provider helps to ensure compliance with applicable laws and protect technology, intellectual property, and organizational security.