Precision Detector Assembly Technician - Cleanroom

Teledyne; Goleta (CA); On-site; USD 39,000 - 52,000; Full time

Benefits offered by this job

Health, Dental, Vision, and Life Ins.

Paid Vacation and Holidays

401(k) with Company Match

Employee Stock Purchase Plan

Tuition Reimbursement

Employee Events

Job summary

Teledyne Technologies Incorporated in Goleta, CA is seeking an assembly support technician for Detector Packaging Operations. Under the supervision of the Detector Packaging Manager, you will progressively improve proficiency in listed technical skills in a clean room/lab environment.

Primary duties include aqueous ultrasonic cleaning, laser marking, getter welding, adhesive die bonding, wirebonding, alignment measurement, vacuum packaging, and stereo zoom microscopy, with documentation for

Qualifications

• Must have high school diploma or GED.
• 2–4 years of technical/manufacturing experience preferred.
• Strong attention to detail and commitment to quality.
• Knowledge of cleanroom protocols and handling of ESD-sensitive components.
• Basic computer proficiency for data entry and documentation.
• Ability to read, write, and communicate in English.

Responsibilities

• Aqueous ultrasonic cleaning operations.
• Laser marking.
• Getter welding.
• Adhesive die bonding.
• Wirebonding and pull testing.
• Alignment measurement.
• Vacuum packaging.
• Multipart test and calibration.
• Stereo zoom microscope.
• Documentation for travelers and WIP tracking.

Skills

Attention to detail

Cleanroom protocols

ESD handling

Data entry

English communication

Manual dexterity

Lifting 25 lbs

Education

High school diploma or GED

Job description

Teledyne Technologies Incorporated in Goleta, CA is seeking an assembly support technician for Detector Packaging Operations. Under the supervision of the Detector Packaging Manager, you will progressively improve proficiency in listed technical skills in a clean room/lab environment.

Primary duties include aqueous ultrasonic cleaning, laser marking, getter welding, adhesive die bonding, wirebonding, alignment measurement, vacuum packaging, and stereo zoom microscopy, with documentation for