Precision Assembly Technician – Cleanroom & Wirebonding

Teledyne Technologies Incorporated; Goleta (CA); On-site; USD 39,000 - 52,000; Full time

Benefits offered by this job

Health, Dental, Vision

Life Insurance

Paid Vacation

401(k) Match

Employee Stock Purchase Plan

Tuition Reimbursement

Team Events

Job summary

Teledyne Technologies Incorporated is seeking an entry-level to mid-level assembler for the Detector Packaging Operations in a cleanroom environment in Goleta, CA. The role provides increasing proficiency in a range of micro-assembly tasks and requires meticulous attention to detail.

The candidate will perform aqueous ultrasonic cleaning, laser marking, getter welding, die bonding, wirebonding, calibration, vacuum packaging, and documentation.

Qualifications

• High school diploma, or GED.
• Typically requires 2-4 years’ technical and/or related experience.
• Must have an attention to detail.
• Must have cleanroom protocol knowledge.
• Must have experience handling ESD sensitive hardware.
• Must have basic computer skills.
• Must be able to communicate clearly and be able to read and write using the English language.
• Ability to work with hands and have good manual dexterity.
• Ability to work in a cleanroom environment and wear protective clothing (shoe covers, hair covers, coveralls, facial masks, gloves) for extended periods of time.
• Must be able to sit for extended periods of time.
• Must be able to lift 25 lbs., unassisted.

Responsibilities

• Aqueous ultrasonic cleaning operations
• Laser marking
• Getter welding
• Adhesive die bonding
• Wirebonding and pull testing
• Alignment measurement
• Vacuum packaging
• Multipart test and calibration
• Stereo zoom microscope
• Documentation for travelers and WIP tracking

Skills

Attention to detail

Cleanroom protocol knowledge

ESD handling

Basic computer skills

Clear communication in English

Manual dexterity

Sitting for extended periods

Education

High school diploma or GED

Job description

Teledyne Technologies Incorporated is seeking an entry-level to mid-level assembler for the Detector Packaging Operations in a cleanroom environment in Goleta, CA. The role provides increasing proficiency in a range of micro-assembly tasks and requires meticulous attention to detail.

The candidate will perform aqueous ultrasonic cleaning, laser marking, getter welding, die bonding, wirebonding, calibration, vacuum packaging, and documentation.