Precise Wire Bonder — Optoelectronics Assembly

GPD Optoelectronics Corp.; Salem (NH); On-site; USD 40,000 - 60,000; Full time

Job summary

GPD Optoelectronics Corp. in Salem, NH is seeking a Wire Bonder to join our precision manufacturing team.

You will perform wire bonding, assembly, inspection, and basic electrical testing of chips mounted to substrates and packages in a cleanroom environment. The role reports to the Director of Operations at our Salem facility and supports production by collaborating with Engineering and Quality to meet product and customer requirements.

Qualifications

• High School / GED or Technical trade school.
• 23 years’ experience in a manufacturing or technical environment.
• Prior experience in microelectronics or optoelectronic assembly preferred (wire bonding experience highly desired).
• Ability to work under a microscope and handle small, delicate components.
• Familiarity with ESD controls, cleanroom practices, and regulated manufacturing environments.
• Strong attention to detail, good manual dexterity, and ability to follow detailed instructions.
• This position may require sitting for long periods at a microscope, bending, reaching, visual acuity for inspection, and lifting up to 30 lbs.

Responsibilities

• Wire bonding of chips and die to ceramic substrates and packages.
• Prep material, set up, and operate wire bond equipment per instructions.
• Handle optoelectronic devices with ESD and cleanroom controls.
• Support engineering builds and process development as needed.
• Conduct visual inspection under microscope per MIL STD883 criteria.
• Perform basic electrical tests and report results.
• Maintain production records and ERP data.
• Package finished assemblies and maintain traceability.

Skills

Wire bonding

Microscope work

Cleanroom practices

ESD controls

Detail-oriented

Manual dexterity

Education

High School / GED or Technical trade school

Job description

GPD Optoelectronics Corp. in Salem, NH is seeking a Wire Bonder to join our precision manufacturing team.

You will perform wire bonding, assembly, inspection, and basic electrical testing of chips mounted to substrates and packages in a cleanroom environment. The role reports to the Director of Operations at our Salem facility and supports production by collaborating with Engineering and Quality to meet product and customer requirements.