Assembly - Wire Bonder

GPD Optoelectronics Corp.; Salem (NH); On-site; USD 40,000 - 60,000; Full time

Job summary

GPD Optoelectronics Corp. in Salem, NH is seeking a Wire Bonder to join our precision manufacturing team.

You will perform wire bonding, assembly, inspection, and basic electrical testing of chips mounted to substrates and packages in a cleanroom environment. The role reports to the Director of Operations at our Salem facility and supports production by collaborating with Engineering and Quality to meet product and customer requirements.

Qualifications

• High School / GED or Technical trade school.
• 23 years’ experience in a manufacturing or technical environment.
• Prior experience in microelectronics or optoelectronic assembly preferred (wire bonding experience highly desired).
• Ability to work under a microscope and handle small, delicate components.
• Familiarity with ESD controls, cleanroom practices, and regulated manufacturing environments.
• Strong attention to detail, good manual dexterity, and ability to follow detailed instructions.
• This position may require sitting for long periods at a microscope, bending, reaching, visual acuity for inspection, and lifting up to 30 lbs.

Responsibilities

• Wire bonding of chips and die to ceramic substrates and packages.
• Prep material, set up, and operate wire bond equipment per instructions.
• Handle optoelectronic devices with ESD and cleanroom controls.
• Support engineering builds and process development as needed.
• Conduct visual inspection under microscope per MIL STD883 criteria.
• Perform basic electrical tests and report results.
• Maintain production records and ERP data.
• Package finished assemblies and maintain traceability.

Skills

Wire bonding

Microscope work

Cleanroom practices

ESD controls

Detail-oriented

Manual dexterity

Education

High School / GED or Technical trade school

Job description

We are scaling tomorrow's world, TODAY! We continue to expand our team, a team is shaping the future of our industry and share our passion to reveal the invisible!

Our Wire Bonders are responsible for precision assembly of optoelectronic components in our cleanroom manufacturing environment. This role supports production operations by performing wire bonding, assembly, inspection, and basic electrical testing of chips / die mounted to ceramic substrates and / or packages such as TO cans and LCCs. The Wire Bonder works as part of a production team reporting to Operations, while collaborating closely with Engineering and Quality to meet product, process, and customer requirements.

This full-time, non-exempt role will report to the Director of Operations and is located at our Salem, NH Facility.

Key Responsibilities

Assembly & Wire Bonding

• Perform manual and semi automated wire bonding of chips and die to ceramic substrates and packages (e.g., TO can, LCC) using various gauges of wire
• Prep material. set up, and operate wire bond equipment per approved work instructions and travelers
• Handle optoelectronic devices using proper ESD, cleanliness, and contamination (FOD) control techniques
• Support engineering builds, process development, and continuous improvement activities, as needed

Inspection, Testing & Quality

• Conduct visual inspection of assemblies under microscope to applicable MIL STD883 workmanship criteria
• Perform basic electrical “go / no go” and at times more advanced testing using standard test fixtures and equipment
• Identify, document, and report nonconforming material or process issues
• Maintain accurate production records, travelers, and inspection results using our ERP system and shop floor interface

Handling, Packaging & Workflow

• Package finished assemblies per work instructions and cleanliness requirements
• Maintain material traceability and proper part identification throughout the process
• Follow cleanroom protocols, including gowning, tool control, and housekeeping standards
• Work effectively within a team environment to meet production schedules and quality goals

Qualifications & Skills

• High School / GED or Technical trade school
• 23 years’ experience in a manufacturing or technical environment.
• Prior experience in microelectronics or optoelectronic assembly preferred (wire bonding experience highly desired)
• Ability to work under a microscope and handle small, delicate components
• Familiarity with ESD controls, cleanroom practices, and regulated manufacturing environments
• Strong attention to detail, good manual dexterity, and ability to follow detailed instructions
• This position may require sitting for long periods at a microscope, bending, reaching, visual acuity for inspection, and lifting up to 30 lbs.

Misc.

• This position may require sitting for long periods at a microscope, bending, reaching, visual acuity for inspection, and lifting up to 30 lbs.
• These activities are performed in a clean room environment which is temperature and humidity controlled.
• This position requires you to wear complete fab attire for an entire shift and meet all safety and cleanroom requirements which can include:
• Hand Hygiene, Personal Item Removal, Gowning Area Preparation,
• Order of Gowning, Shoe Covers, Hair Covers, Face Masks, Coveralls/Gowns, Gloves, Additional Garments, Final Inspection and maintaining proper protocols.

GPD provides equal employment opportunities to all employees and applicants for employment and prohibits discrimination and harassment of any type without regard to race, color, religion, age, sex, national origin, disability status, genetics, protected veteran status, sexual orientation, gender identity or expression, or any other characteristic protected by federal, state or local laws. This policy applies to all terms and conditions of employment, including recruiting, hiring, placement, promotion, termination, layoff, recall, transfer, leaves of absence, compensation and training.

About GPD

At GPD Optoelectronics, we believe that by operating with integrity and trust we drive constant organizational improvement, which strengthens our relationships with our employees and customers. Customer success remains our highest priority, so we strive to deliver high-quality products on time, and provide unparalleled service, responsiveness, and collaboration.

Founded in 1973 as Germanium Power Devices Corp, we began by making high-quality germanium transistors. Since the early 1980’s we have earned our place as a trusted manufacturer of both germanium and indium gallium arsenide photodiodes. We are located in Salem, NH.