Wire Bond - Operator, Assembly

GPD Optoelectronics Corp.; Salem (NH); On-site; USD 42,000 - 60,000; Full time

Job summary

GPD Optoelectronics Corp. seeks a Wire Bonder to join our Salem, NH manufacturing team.

The role involves precision wire bonding, assembly, inspection, and basic electrical testing of optoelectronic components in a controlled cleanroom environment. Responsibilities include preparing materials, operating wire bond equipment, performing visual and electrical checks, maintaining records, and ensuring strict ESD and cleanliness standards.

Qualifications

• High School / GED or Technical trade school.
• 23 years’ experience in a manufacturing or technical environment.
• Prior experience in microelectronics or optoelectronic assembly preferred (wire bonding experience highly desired).
• Ability to work under a microscope and handle small, delicate components.
• Familiarity with ESD controls, cleanroom practices, and regulated manufacturing environments.
• Strong attention to detail and manual dexterity.

Responsibilities

• Perform manual and semi-automated wire bonding of chips and die to ceramic substrates and packages using various gauges of wire.
• Prep material, set up, and operate wire bond equipment per approved work instructions and travelers.
• Handle optoelectronic devices using proper ESD, cleanliness, and contamination control techniques.
• Support engineering builds, process development, and continuous improvement activities, as needed.
• Conduct visual inspection of assemblies under microscope to MIL STD883 workmanship criteria.
• Perform basic electrical tests using standard test fixtures and equipment.
• Identify, document, and report nonconforming material or process issues.
• Maintain accurate production records, travelers, and inspection results using ERP system.
• Package finished assemblies per work instructions and cleanliness requirements.
• Maintain material traceability and proper part identification throughout the process.
• Follow cleanroom protocols, gowning, tool control, and housekeeping standards.
• Work effectively within a team environment to meet production schedules and quality goals.
• Handle safe operation and PPE in a cleanroom environment.

Skills

Wire bonding

Cleanroom environment

ESD controls

Manual dexterity

Attention to detail

Education

High School diploma

Technical trade school

Tools

Wire bond equipment

Job description

Overview

We are scaling tomorrow's world, TODAY! We continue to expand our team, a team is shaping the future of our industry and share our passion to reveal the invisible! Our Wire Bonders are responsible for precision assembly of optoelectronic components in our cleanroom manufacturing environment. This role supports production operations by performing wire bonding, assembly, inspection, and basic electrical testing of chips/die mounted to ceramic substrates and/or packages such as TO cans and LCCs. The Wire Bonder works as part of a production team reporting to Operations, while collaborating closely with Engineering and Quality to meet product, process, and customer requirements. This full‑time, non‑exempt role will report to the Director of Operations and is located at our Salem, NH Facility.

Key Responsibilities

• Perform manual and semi‑automated wire bonding of chips and die to ceramic substrates and packages (e.g., TO can, LCC) using various gauges of wire
• Prep material, set up, and operate wire bond equipment per approved work instructions and travelers
• Handle optoelectronic devices using proper ESD, cleanliness, and contamination (FOD) control techniques
• Support engineering builds, process development, and continuous improvement activities, as needed
• Conduct visual inspection of assemblies under microscope to applicable MIL STD883 workmanship criteria
• Perform basic electrical “go / no-go” and at times more advanced testing using standard test fixtures and equipment
• Identify, document, and report nonconforming material or process issues
• Maintain accurate production records, travelers, and inspection results using our ERP system and shop floor interface
• Package finished assemblies per work instructions and cleanliness requirements
• Maintain material traceability and proper part identification throughout the process
• Follow cleanroom protocols, including gowning, tool control, and housekeeping standards
• Work effectively within a team environment to meet production schedules and quality goals
• Handle safe operation and personal protective equipment in a cleanroom environment (temperature/humidity controlled)
• Wear complete fab attire for an entire shift and meet all safety and cleanroom requirements, including hand hygiene, personal item removal, gowning area preparation, order of gowning, shoe covers, hair covers, face masks, coveralls/gowns, gloves, additional garments, final inspection, and maintaining proper protocols

Qualifications & Skills

• High School / GED or Technical trade school
• 23 years’ experience in a manufacturing or technical environment
• Prior experience in microelectronics or optoelectronic assembly preferred (wire bonding experience highly desired)
• Ability to work under a microscope and handle small, delicate components
• Familiarity with ESD controls, cleanroom practices, and regulated manufacturing environments
• Strong attention to detail, good manual dexterity, and ability to follow detailed instructions
• Physical ability to sit for long periods at a microscope, bend, reach, maintain visual acuity for inspection, and lift up to 30 lbs.

Equal Employment Opportunity Statement

GPD provides equal employment opportunities to all employees and applicants for employment and prohibits discrimination and harassment of any type without regard to race, color, religion, age, sex, national origin, disability status, genetics, protected veteran status, sexual orientation, gender identity or expression, or any other characteristic protected by federal, state or local laws. This policy applies to all terms and conditions of employment, including recruiting, hiring, placement, promotion, termination, layoff, recall, transfer, leaves of absence, compensation and training.