Postdoctoral Fellow (PREP0004280)

OHB System AG; Gaithersburg (MD); Sur place; USD 70 000 - 89 000; Plein temps

Résumé du poste

The Chronicle Of Higher Education, Inc. is seeking a PREP Research Associate in Gaithersburg, Maryland. This role involves designing and implementing test methods for evaluating chip bonding quality, requiring a PhD in a relevant field. Additional qualifications include experience with wafer bonding processes and proficiency in finite element modeling tools like COMSOL and ANSYS. The salary ranges from $70,000 to $89,000, with attractive total rewards. This position promises a collaborative environment supporting semiconductor advanced packaging.

Qualifications

• PhD in a related field is required.
• Experience with wafer/hybrid chip bonding processes crucial.
• Desirable skills include infrared microscopy and optical measurements.

Responsabilités

• Design and model test methods for bond quality evaluation.
• Coordinate with teams for materials characterization.
• Implement bond strength testing at varying temperatures.

Connaissances

Finite element modeling

CAD proficiency

Programming languages

Communication skills

Experience with wafer bonding

Destructive test methods

Infrared microscopy

Formation

PhD in mechanical engineering, physics, electrical engineering, materials science, or a related field

Outils

COMSOL

ANSYS

SolidWorks

Autodesk

Python

Java

Matlab

Description du poste

PREP Research Associate

Salary: $70,000 - $89,000

Research Title

Metrology of Materials, Surfaces, and Processes for Semiconductor Advanced Packaging

Responsibilities

• Design, model, and performance of test methods to evaluate bond quality of bonded chip pairs using different wafer materials and bond methods.
• Design and fabrication of test rigs for bond strength measurement.
• Implement bond strength testing at cryogenic and high temperatures.
• Closely coordinate with teams performing materials characterization, surface and thin film characterization.

Qualifications

• PhD in mechanical engineering, physics, electrical engineering, materials science, or a related field.
• Experience with wafer and/or hybrid chip bonding processes.
• Experience with destructive test methods, such as those utilizing materials test machines or related instruments.
• Proficiency in finite element modeling, using tools such as COMSOL or ANSYS.
• Proficiency in CAD, using tools such as SolidWorks or Autodesk.
• Proficiency in programming languages, such as Python, Java, or Matlab.
• Excellent communication skills and ability to work effectively in a team.
• Experience, including process development, in back-end semiconductor device fabrication, including wafer cleaning and handling (desirable).
• Familiarity with silicon electronic and photonic device processing (desirable).
• Experience with custom infrared microscopy and optical measurement setups (desirable).
• US citizenship strongly preferred (desirable).

Equal Employment Opportunity Statement

The Johns Hopkins University is committed to equal opportunity and does not discriminate on the basis of sex, gender, marital status, pregnancy, race, color, ethnicity, national origin, age, disability, religion, sexual orientation, gender identity, veteran status or other legally protected characteristic. Qualified individuals are given access to all academic and employment programs, benefits and activities on the basis of demonstrated ability, performance and merit.

Total Rewards

Johns Hopkins offers a total rewards package that supports our employees' health, life, career and retirement. More information can be found here: https://hr.jhu.edu/benefits-worklife/