Postdoc: Finite Element Modeling for Chip Packaging

Johns Hopkins University; Baltimore (MD); On-site; USD 62,000 - 86,000; Full time

Benefits offered by this job

Comprehensive healthcare benefits

Retirement plans

Career development opportunities

Job summary

Johns Hopkins University is hiring a Research Associate for a project funded by the CHIPS program. This role focuses on modeling and mechanical testing of advanced semiconductor packaging. Candidates should possess a Ph.D. in relevant fields and have expertise in finite element analysis.

The position requires strong communication skills and the ability to collaborate with various stakeholders in cutting-edge research aimed at advancing semiconductor reliability.

Qualifications

• U.S. citizenship is preferred.
• Currently live in the United States.
• Experience in nano- and micro-scale mechanical testing.
• Experience in advanced semiconductor packaging is preferred.

Responsibilities

• Develop finite element models of thermomechanical behavior of heterogeneous multilayered systems.
• Characterize degradation of materials before and after accelerated aging.
• Develop reliability models for advanced packaging systems.
• Provide technical leadership in modeling failure mechanisms.
• Disseminate research results through presentations and publications.

Skills

Finite element modeling

Mechanical testing

Materials characterization

Strong communication skills

Education

Ph.D. in Physics, Mechanical Engineering, Electrical Engineering, Materials Science, or Chemical Engineering

Job description

Johns Hopkins University is hiring a Research Associate for a project funded by the CHIPS program. This role focuses on modeling and mechanical testing of advanced semiconductor packaging. Candidates should possess a Ph.D. in relevant fields and have expertise in finite element analysis.

The position requires strong communication skills and the ability to collaborate with various stakeholders in cutting-edge research aimed at advancing semiconductor reliability.