PFA Engineer Intern: Failure Analysis & Yield

Micron Technology, Inc; Boise (ID); On-site; USD 25,000 - 35,000; Full time

Job summary

Micron Technology, Inc seeks an YE Engineering Intern for Summer 2026 in Boise, ID. You will explore physical failure analysis of DRAM/NAND devices, perform delayering, and use FIB/STEM/SEM tools to generate insights for yield improvement.

You will learn device operation and failure modes, develop critical problem-solving skills, and work with advanced equipment in a cutting-edge fab environment.

Qualifications

• Enrolled in a 4-year program and available summer 2026.
• Majoring in Electrical/Electronics or related field with strong lab skills.
• Experience or interest in failure analysis is a plus.

Responsibilities

• Demonstrate understanding of electrical testing and physical failure analysis on memory devices.
• Delayering devices using wet and dry techniques.
• Operate FIB and STEM/TEM for cross-section analysis and SEM for top-down analysis.
• Generate images for inline process improvement and learn failure mechanisms.

Skills

Analytical skills

Laboratory work

Electrical engineering concepts

Education

Bachelor's degree in EE/ Electronics/ Materials Science/ Physics/ Chemistry/ Chemical Eng

First year to Junior level coursework or graduating by Spring 2027

Tools

FIB (Focused Ion Beam)

STEM/TEM analysis

Job description

Micron Technology, Inc seeks an YE Engineering Intern for Summer 2026 in Boise, ID. You will explore physical failure analysis of DRAM/NAND devices, perform delayering, and use FIB/STEM/SEM tools to generate insights for yield improvement.

You will learn device operation and failure modes, develop critical problem-solving skills, and work with advanced equipment in a cutting-edge fab environment.