Product Yield Enhancement Intern — DRAM & Data Analytics

1000 Micron Technology, Inc.; Boise (ID); On-site; USD 22,000 - 45,000; Full time

Benefits offered by this job

Medical, dental and vision plans

Paid time-off and holidays

Wellness and life insurance

Job summary

Micron Technology Inc. is offering a 3-month internship as an Intern Product Yield Enhancement (PYE) Engineer in Boise, Idaho.

You will analyze DRAM failures, work with R&D, Manufacturing, and Quality teams, and gain hands-on experience with memory systems and the product lifecycle. Ideal candidates are pursuing a bachelor’s degree in EE, CE, Physics or Materials Science with strong problem-solving and analytical skills and an expected graduation after Sept 1, 2027.

Qualifications

• Must be pursuing a minimum of a bachelor’s degree in Electrical Engineering, Computer Engineering, Physics or Materials Science
• Excellent problem-solving and analytical skills
• Expected graduation date must not be before September 1st, 2027

Responsibilities

• Detailed DRAM electrical and physical failure analysis.
• Identify defects introduced by the semiconductor fabrication process.
• Data mine using statistical analysis, AI-assisted engineering tools and automation workflows.
• Find root causes of failure mechanisms and communicate results to Management, Product, Process and Test Engineering teams.
• Complete 3-month internship.

Skills

Problem solving

Analytical skills

Python

AI tools

Education

Bachelor’s degree in Electrical Engineering

Bachelor’s degree in Computer Engineering

Bachelor’s degree in Physics

Bachelor’s degree in Materials Science

Job description

Micron Technology Inc. is offering a 3-month internship as an Intern Product Yield Enhancement (PYE) Engineer in Boise, Idaho.

You will analyze DRAM failures, work with R&D, Manufacturing, and Quality teams, and gain hands-on experience with memory systems and the product lifecycle. Ideal candidates are pursuing a bachelor’s degree in EE, CE, Physics or Materials Science with strong problem-solving and analytical skills and an expected graduation after Sept 1, 2027.