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Micron Technology in Boise invites an YE Engineering Intern to explore Physical Failure Analysis within state-of-the-art fabs. You will work on delayering, FIB/STEM/TEM cross-section analysis, and inline yield feedback, gaining hands-on experience with semiconductor devices.
The internship emphasizes problem solving, learning processes, and applying AI-enabled approaches where relevant. This role offers exposure to cutting-edge equipment and a path toward future opportunities at Micron.
Micron Technology in Boise invites an YE Engineering Intern to explore Physical Failure Analysis within state-of-the-art fabs. You will work on delayering, FIB/STEM/TEM cross-section analysis, and inline yield feedback, gaining hands-on experience with semiconductor devices.
The internship emphasizes problem solving, learning processes, and applying AI-enabled approaches where relevant. This role offers exposure to cutting-edge equipment and a path toward future opportunities at Micron.