Yield Enhancement Engineer—Electrical Failure Analysis

Micron Memory Malaysia Sdn Bhd; Boise (ID); On-site; USD 90,000 - 120,000; Full time

Job summary

Micron Technology in Boise, Idaho, is seeking a Product Yield Enhancement (PYE) Electrical Failure Analysis Engineer to lead failure analysis across the memory product lifecycle. You will isolate defects using emission microscopy, laser techniques, and EOTPR while modeling fail signatures from backend data.

You will work with cross-functional teams to identify root causes, develop corrective actions, and drive yields improvements for next-generation memory products.

Qualifications

• Bachelor's degree in Electrical Engineering, Materials Science, Physics, or a related technical discipline
• 2+ years of experience in semiconductor failure analysis, yield enhancement, or a closely related field
• Hands-on experience with fault isolation techniques including emission microscopy, laser-based methods (OBIRCH/TIVA), and EOTPR
• Working knowledge of CMOS fabrication processes and package assembly flows
• Proficiency in reading and interpreting semiconductor layout and schematic designs
• Experience with Physical Failure Analysis (PFA) tools and de-processing techniques (e.g., FIB, cross-section, delayering)
• Ability to perform data extractions and analysis from fab, probe, and backend test systems
• Strong written and verbal communication skills with the ability to generate clear, organized failure analysis reports

Responsibilities

• Perform Electrical Failure Analysis and Fault Isolation using emission microscopy, laser techniques, EOTPR, and PFA/de-processing methods
• Characterize and model backend test, internal qualification, and RMA fail signatures using layout, schematic, and data analysis tools
• Apply in-depth knowledge of CMOS fabrication processes and package assembly flows to identify process- and assembly-related defects, root causes, and downstream effects
• Evaluate reliability concerns and delayed breakdown failure mechanisms across test insertions
• Perform fab, probe, and backend data extractions to provide supplemental data supporting failure analysis conclusions
• Generate organized and timely failure analysis reports with clearly communicated causes, effects, and recommended actions
• Present and coordinate findings cross-functionally with Management, Product, Process, Assembly, and Global Quality teams

Skills

Electrical Failure Analysis

Fault Isolation

CMOS fabrication

Schematic reading

Data analysis

Python/MATLAB

Education

Bachelor's degree in Electrical Engineering / Materials Science / Physics

Master's degree or Ph.D. preferred

Tools

Emission microscopy

OBIRCH/TIVA laser techniques

EOTPR

PFA/de-processing (FIB, cross-section)

Data extraction from fab/probe

Job description

Micron Technology in Boise, Idaho, is seeking a Product Yield Enhancement (PYE) Electrical Failure Analysis Engineer to lead failure analysis across the memory product lifecycle. You will isolate defects using emission microscopy, laser techniques, and EOTPR while modeling fail signatures from backend data.

You will work with cross-functional teams to identify root causes, develop corrective actions, and drive yields improvements for next-generation memory products.