Paid Embedded Software Intern – C/C++, Agile & Global Team

Eaton

Franksville (WI)

Presencial

USD 31.000 - 52.000

Jornada completa

Hace 4 días
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Ventajas ofrecidas por este puesto de trabajo

Relocation assistance
Paid internship

Descripción de la vacante

Eaton is offering a twelve-week paid Embedded Software Engineering Internship at its Thomas A. Edison Technical Center in Franksville, WI. You’ll work with experienced engineers on NPD projects, performing analyses, designing components, and developing unit tests.

In this role you will contribute to efficient, reliable, safe, and sustainable product solutions, collaborating with global teams across software, hardware, and power systems. GPA and immigration sponsorship constraints apply.

Formación

  • Actively enrolled in or pursuing a bachelor’s or master’s degree in Electrical/Electronics/Computer Engineering or Computer Science with graduation no earlier than Dec 2027.
  • Minimum GPA of 2.8 or above.
  • Eaton will not sponsor CPT, OPT, STEM OPT or other immigration pathways.

Responsabilidades

  • Work with hardware drivers and embedded applications, networking and related areas primarily using C, C++, and Python.
  • Collaborate with global multidisciplinary teams to deliver products and features for the Utility Intelligent Devices team.
  • Set aggressive goals, measure performance, and strive to exceed expectations.
  • Effectively communicate within a global team environment.

Conocimientos

C
C++
Python
Agile Scrum

Educación

Bachelor's or Master’s in Electrical/ Electronics/ Computer Engineering or Computer Science

Descripción del empleo

Eaton is offering a twelve-week paid Embedded Software Engineering Internship at its Thomas A. Edison Technical Center in Franksville, WI. You’ll work with experienced engineers on NPD projects, performing analyses, designing components, and developing unit tests.

In this role you will contribute to efficient, reliable, safe, and sustainable product solutions, collaborating with global teams across software, hardware, and power systems. GPA and immigration sponsorship constraints apply.

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