Packaging Engineering Intern -- Hands-On Prototyping

Socket.dev; Austin (TX); On-site; USD 108,000 - 126,000; Part time

Benefits offered by this job

Housing stipend

Lunches daily

Weekly learning & development

Commuter benefits

Paid time off

Visa sponsorship

Medical, dental, and vision insurance

401(k)

Life and disability insurance

Job summary

fab2 is a startup in Austin, TX hiring Semiconductor Packaging Engineering Interns for the summer term. The role is hands-on, involving research and development of new packaging technologies, with exposure to 3D printing, metal plating, lasering and metrology.

A portfolio showing built projects is required, and a commitment of 4 to 8 months is preferred. The team works end-to-end on packaging processes, with interns learning to move quickly through design cycles and collaborate with

Qualifications

• Pursuing a Bachelor's degree in engineering or higher.
• 1-2 hands-on wet-lab or lab-adjacent experiences, ideally in metal plating or device fabrication.
• Strong foundation in mechanical engineering (SolidWorks/Onshape, materials selection).
• Hands-on prototyping experience and ability to move through design cycles quickly.

Responsibilities

• Design and iterate on machines and subsystems for semiconductor packaging fabrication (laser ablation machines, reflow ovens, automated metal plating facilities).
• Integrate mechanical, electrical, and optical components in system assembly (wiring, optics alignment, electronics).
• Collaborate with cross-functional teams to improve fabrication processes and equipment.
• Hands-on package/wafer processing (3D printing, metal plating, lithography, metrology).

Skills

Mechanical Eng

Prototyping

Design Iteration

CAD: SolidWorks/Onshape

Systems Integration

Education

Pursuing Bachelor's degree in engineering

Tools

3D printing

Metrology equipment

Laser ablation hardware

Job description

fab2 is a startup in Austin, TX hiring Semiconductor Packaging Engineering Interns for the summer term. The role is hands-on, involving research and development of new packaging technologies, with exposure to 3D printing, metal plating, lasering and metrology.

A portfolio showing built projects is required, and a commitment of 4 to 8 months is preferred. The team works end-to-end on packaging processes, with interns learning to move quickly through design cycles and collaborate with