Semiconductor Packaging Engineer - 3D-Printed Solutions

Fab2; Austin (TX); On-site; USD 110,000 - 155,000; Full time

Benefits offered by this job

Medical, Dental & Vision

Generous PTO

Visa Sponsorship

Life & Disability Insurance

Parental Leave

401(k) retirement plan

Learning & Development opportunities

Commuter benefits

Daily lunches / dinners

Stocked office kitchen

Job summary

fab2 is seeking a Packaging Engineer to shape full-stack semiconductor packaging processes, including lithography, deposition, die attaching and bonding. You will drive development and testing with a hands-on team, integrating 3D printing where helpful to improve performance, reliability and manufacturability.

The role requires 5+ years in packaging, a strong EE/ME/Materials background, and a passion for exploring new technologies. Austin-based, on-site, with generous equity and compensation.

Qualifications

• Masters or equivalent in EE, Material Science, Mechanical Eng or related field.
• 5+ years in semiconductor packaging with end-to-end process knowledge.
• Knowledge of packaging materials, thermal management and reliability testing.

Responsibilities

• Explore and validate innovative semiconductor packaging processes.
• Conduct hands-on lab experiments end-to-end to test ideas.
• Develop and optimize packaging materials for performance and reliability.
• Evaluate processes to improve performance and manufacturability.
• Collaborate across teams and document SOPs; maintain equipment safety.

Skills

Semiconductor packaging

Thermal management

Reliability testing

Lab testing

Problem solving

Education

Masters or equivalent (Electrical Engineering / Material Science / Mechanical Engineering)

Tools

3D printing

Metal plating

Electronic design

Job description

fab2 is seeking a Packaging Engineer to shape full-stack semiconductor packaging processes, including lithography, deposition, die attaching and bonding. You will drive development and testing with a hands-on team, integrating 3D printing where helpful to improve performance, reliability and manufacturability.

The role requires 5+ years in packaging, a strong EE/ME/Materials background, and a passion for exploring new technologies. Austin-based, on-site, with generous equity and compensation.