Packaging Engineering Intern - Summer

Socket.dev; Austin (TX); On-site; USD 108,000 - 126,000; Part time

Benefits offered by this job

Housing stipend

Lunches daily

Weekly learning & development

Commuter benefits

Paid time off

Visa sponsorship

Medical, dental, and vision insurance

401(k)

Life and disability insurance

Job summary

fab2 is a startup in Austin, TX hiring Semiconductor Packaging Engineering Interns for the summer term. The role is hands-on, involving research and development of new packaging technologies, with exposure to 3D printing, metal plating, lasering and metrology.

A portfolio showing built projects is required, and a commitment of 4 to 8 months is preferred. The team works end-to-end on packaging processes, with interns learning to move quickly through design cycles and collaborate with

Qualifications

• Pursuing a Bachelor's degree in engineering or higher.
• 1-2 hands-on wet-lab or lab-adjacent experiences, ideally in metal plating or device fabrication.
• Strong foundation in mechanical engineering (SolidWorks/Onshape, materials selection).
• Hands-on prototyping experience and ability to move through design cycles quickly.

Responsibilities

• Design and iterate on machines and subsystems for semiconductor packaging fabrication (laser ablation machines, reflow ovens, automated metal plating facilities).
• Integrate mechanical, electrical, and optical components in system assembly (wiring, optics alignment, electronics).
• Collaborate with cross-functional teams to improve fabrication processes and equipment.
• Hands-on package/wafer processing (3D printing, metal plating, lithography, metrology).

Skills

Mechanical Eng

Prototyping

Design Iteration

CAD: SolidWorks/Onshape

Systems Integration

Education

Pursuing Bachelor's degree in engineering

Tools

3D printing

Metrology equipment

Laser ablation hardware

Job description

About fab2

The fab2 team can build anything. We design all the hardware and software needed to make chips and we make the fabs, tools, and components ourselves.We're looking for exceptional, hands-on people who can iterate to the limits of what's possible.

About the Role

We’re hiring Semiconductor Packaging Engineering Interns for the summer term. The internship begins in May or June, with a preferred commitment of 4 to 8 months. We are a small team engaged in end-to-end process development and integration work for semiconductor packaging processes, providing exposure to interesting work that is hard to find at larger companies. This is a hands-on engineering role—meaning you will be actively involved in the research and development of new packaging technologies, including mechanical prototyping, experiment design, and data analysis. We train our interns on most of our tools and allow them to use these tools independently, including 3d printing, metal plating, lasering, and metrology.

Our philosophy is to get things built and tested in days or weeks, not months. Because of this, a portfolio is required to apply: show us the things you’ve actually built! If you’ve shipped a medium-to-high complexity system through a personal project or previous internship, you’d be a good fit here.

Responsibilities

• Design and iterate on machines and subsystems for semiconductor packaging fabrication, such as laser ablation machines, reflow ovens, and automated metal plating facilities

• Integrate mechanical, electrical, and optical components in system assembly, including wiring, optics alignment, and electronics

• Collaborate with cross-functional teams to continuously improve fabrication processes and equipment

• Hands-on package/wafer processing (3d printing, metal plating, lithography, metrology)

Required Experience

• Pursuing a Bachelor’s Degree or higher in engineering

• At least 1-2 hands-on wet lab or lab-adjacent experiences, ideally in metal plating work or fabricating devices

• Strong foundation in mechanical engineering (Solidworks/Onshape, materials selection, etc.)

• Hands-on prototyping experience and the ability to move through design cycles quickly

Nice-to-have

• Proven experience in mechatronics or electromechanical system design

• Familiarity with lasering and 3D printing (stereolithography)

• Reliability testing, soldering, and reflow testing

• Hands-on experience with nano-fabrication tools (etching, deposition, patterning) and metrology tools (SEM, thin film measurement, X-ray, etc.)

Working at fab2

We’re an early-stage hardware startup with solid funding, world-class advisors, and labs/offices in Austin, TX, Lockhart, TX, and San Francisco, CA. fab2 is committed to fair and equitable compensation. Packaging Interns are paid hourly, at a rate equivalent to an annualized range of $108,000-$126,000 depending on experience and education. Actual earnings vary with hours worked.

Internship Benefits:

• Housing Stipend to help with first month expenses

• Lunches daily, Dinners 3x per week, Stocked Office Kitchen with Snacks and Spindrifts

• Weekly Learning & Development opportunities

• Commuter Benefits including Parking and Late Night Uber rides from the office

• Paid Time Off inclusive of Holidays and Sick Time

• Visa Sponsorship

• Medical, Dental, and Vision insurance

• 401(k) retirement plan

• Life and Disability Insurance

We are an equal-opportunity employer and do not discriminate on the basis of race, religion, national origin, gender, sexual orientation, age, veteran status, disability or other legally protected statuses.

Export Control Analysis:

This position involves access to technology that is subject to U.S. export controls. Any job offer made will be contingent upon the applicant’s capacity to serve in compliance with U.S. export controls.

fab2, formerly known as Atomic Semi