Packaging Engineering Intern - Winter

Fab2; Austin (TX); On-site; USD 108,000 - 126,000; Full time

Benefits offered by this job

Housing stipend

Meals provided

Weekly learning opportunities

Commuter benefits

Paid time off

Visa sponsorship

Health, dental, and vision insurance

401(k) retirement plan

Life and disability insurance

Job summary

fab2 in Austin, TX is seeking Semiconductor Packaging Engineering Interns for the winter term. The role is hands-on and hardware-focused, involving mechanical prototyping, experiment design, and data analysis. You will work on packaging fabrication equipment and join cross-functional engineering teams to improve processes.

The internship begins in January for 4–8 months. Interns receive training on tools including 3D printing, lithography, metallization, and metrology, with pay aligned to an

Qualifications

• Pursuing a Bachelor's Degree in engineering.
• 1–2 hands-on wet lab or lab-adjacent experiences preferred.
• Strong foundation in mechanical engineering and design.
• Hands-on prototyping experience and rapid design iteration.

Responsibilities

• Design and iterate machines and subsystems for semiconductor packaging fabrication (laser ablation, reflow ovens, automated plating).
• Integrate mechanical, electrical, and optical components in system assembly (wiring, optics alignment, electronics).
• Collaborate with cross-functional teams to improve fabrication processes and equipment.
• Hands-on package/wafer processing (3D printing, plating, lithography, metrology).

Skills

Prototype development

Mechanical design

Cross-functional collaboration

Hands-on engineering

Education

Bachelor's degree in engineering

Tools

SolidWorks

Onshape

Metrology equipment

Job description

About fab2

The fab2 team can build anything. We design all the hardware and software needed to make chips and we make the fabs, tools, and components ourselves.
We're looking for exceptional, hands-on people who can iterate to the limits of what's possible.

About the Role

We're hiring Semiconductor Packaging Engineering Interns for the winter term. The internship begins in January, with a preferred commitment of 4 to 8 months. We are a small team engaged in end-to-end process development and integration work for semiconductor packaging processes, providing exposure to interesting work that is hard to find at larger companies. This is a hands-on engineering role-meaning you will be actively involved in the research and development of new packaging technologies, including mechanical prototyping, experiment design, and data analysis. We train our interns on most of our tools and allow them to use these tools independently, including 3d printing, metal plating, lasering, and metrology.

Our philosophy is to get things built and tested in days or weeks, not months. Because of this, a portfolio is required to apply: show us the things you've actually built! If you've shipped a medium-to-high complexity system through a personal project or previous internship, you'd be a good fit here.

Responsibilities

• Design and iterate on machines and subsystems for semiconductor packaging fabrication, such as laser ablation machines, reflow ovens, and automated metal plating facilities
• Integrate mechanical, electrical, and optical components in system assembly, including wiring, optics alignment, and electronics
• Collaborate with cross-functional teams to continuously improve fabrication processes and equipment
• Hands-on package/wafer processing (3d printing, metal plating, lithography, metrology)

Required Experience

• Pursuing a Bachelor's Degree or higher in engineering
• At least 1-2 hands-on wet lab or lab-adjacent experiences, ideally in metal plating work or fabricating devices
• Strong foundation in mechanical engineering (Solidworks/Onshape, materials selection, etc.)
• Hands-on prototyping experience and the ability to move through design cycles quickly

Nice-to-have

• Proven experience in mechatronics or electromechanical system design
• Familiarity with lasering and 3D printing (stereolithography)
• Reliability testing, soldering, and reflow testing
• Hands-on experience with nano-fabrication tools (etching, deposition, patterning) and metrology tools (SEM, thin film measurement, X-ray, etc.)

Working at fab2

We're an early-stage hardware startup with solid funding, world-class advisors, and offices in Austin, TX and San Francisco, CA. fab2 is committed to fair and equitable compensation. Packaging Interns are paid hourly, at a rate equivalent to an annualized range of $108,000-$126,000 depending on experience and education. Actual earnings vary with hours worked.

Internship Benefits:

• Housing Stipend to help with first month expenses
• Lunches daily, Dinners 3x per week, Stocked Office Kitchen with Snacks and Spindrifts
• Weekly Learning & Development opportunities
• Commuter Benefits including Parking and Late Night Uber rides from the office
• Paid Time Off inclusive of Holidays and Sick Time
• Visa Sponsorship
• Medical, Dental, and Vision insurance
• 401(k) retirement plan
• Life and Disability Insurance

We are an equal-opportunity employer and do not discriminate on the basis of race, religion, national origin, gender, sexual orientation, age, veteran status, disability or other legally protected statuses.

Export Control Analysis: This position involves access to technology that is subject to U.S. export controls. Any job offer made will be contingent upon the applicant's capacity to serve in compliance with U.S. export controls.

fab2, formerly known as Atomic Semi