Packaging Engineer Intern: Thermal & Substrate Design

MACOM; Milpitas (CA); On-site; USD 28,000 - 65,000; Part time

Job summary

MACOM invites an enthusiastic Packaging Engineer Intern to join our team in Milpitas, CA for a 12-week program. You will assist with bump mask design, substrate design, and thermal analyses while working under a senior engineer's guidance.

Ideal candidates are pursuing Mechanical or Thermal Engineering, proficient in Autocad/Solidworks, and familiar with FEA tools such as ANSYS, Icepak, or Flotherm. Expected hourly range: $20–$47 per hour, commensurate with experience and location.

Qualifications

• Pursuing a degree in mechanical/thermal engineering with coursework in packaging.
• Hands-on design and analysis experience in packaging concepts and processes.
• Familiar with design reviews and manufacturing guidelines for IC packaging.

Responsibilities

• Assist Packaging Engineer with bump mask design and substrate design tasks.
• Conduct thermal analysis and support design reviews to ensure manufacturability.
• Contribute to project delivery and present results at internal sessions.
• Gain hands-on experience through a defined internship project.

Skills

Autocad

Solidworks

FEA tools

Education

Mechanical / Thermal Engineering student

Tools

ANSYS

Icepak

Flotherm

Job description

MACOM invites an enthusiastic Packaging Engineer Intern to join our team in Milpitas, CA for a 12-week program. You will assist with bump mask design, substrate design, and thermal analyses while working under a senior engineer's guidance.

Ideal candidates are pursuing Mechanical or Thermal Engineering, proficient in Autocad/Solidworks, and familiar with FEA tools such as ANSYS, Icepak, or Flotherm. Expected hourly range: $20–$47 per hour, commensurate with experience and location.