Mechanical Engineering Intern: Thermal & IC Packaging

Qualcomm; San Diego (CA); On-site; USD 81,000 - 135,000; Full time

Benefits offered by this job

Relocation coverage

Furnished housing for internship

Job summary

Qualcomm Technologies, Inc. offers a Mechanical Engineering Internship for summer 2027.

You will design, simulate, and test mechanical and thermal systems supporting advanced semiconductor technologies, working as an equal contributor on a team of leading engineers inside a broad internship program. Based on your resume, you will be aligned to the Mechanical Engineering track, with opportunities to gain real-world experience in IC packaging, thermal modeling, and cooling solutions, in a program

Qualifications

• Currently pursuing a degree in mechanical engineering, materials science, or related field.
• Available for 11–14 weeks in Summer 2027 (May–September).
• Graduation date November 2027 or later.

Responsibilities

• Design, simulate, and test mechanical and thermal systems for Qualcomm technologies.
• Collaborate with a team of engineers on IC packaging and thermal modeling.
• Contribute to projects across chip/package co-design and cooling solutions.

Skills

Python

MATLAB

Education

Bachelor/Master/PhD in mechanical engineering or related

Tools

Cadence Sip

AutoCAD

Solidworks

Job description

Qualcomm Technologies, Inc. offers a Mechanical Engineering Internship for summer 2027.

You will design, simulate, and test mechanical and thermal systems supporting advanced semiconductor technologies, working as an equal contributor on a team of leading engineers inside a broad internship program. Based on your resume, you will be aligned to the Mechanical Engineering track, with opportunities to gain real-world experience in IC packaging, thermal modeling, and cooling solutions, in a program