Mechanical Engineering Intern: Thermal & IC Packaging

Qualcomm; San Diego (CA); Presencial; USD 81.000 - 135.000; Jornada completa

Ventajas ofrecidas por este puesto de trabajo

Relocation coverage

Furnished housing for internship

Descripción de la vacante

Qualcomm Technologies, Inc. offers a Mechanical Engineering Internship for summer 2027.

You will design, simulate, and test mechanical and thermal systems supporting advanced semiconductor technologies, working as an equal contributor on a team of leading engineers inside a broad internship program. Based on your resume, you will be aligned to the Mechanical Engineering track, with opportunities to gain real-world experience in IC packaging, thermal modeling, and cooling solutions, in a program

Formación

• Currently pursuing a degree in mechanical engineering, materials science, or related field.
• Available for 11–14 weeks in Summer 2027 (May–September).
• Graduation date November 2027 or later.

Responsabilidades

• Design, simulate, and test mechanical and thermal systems for Qualcomm technologies.
• Collaborate with a team of engineers on IC packaging and thermal modeling.
• Contribute to projects across chip/package co-design and cooling solutions.

Conocimientos

Python

MATLAB

Educación

Bachelor/Master/PhD in mechanical engineering or related

Herramientas

Cadence Sip

AutoCAD

Solidworks

Descripción del empleo

Qualcomm Technologies, Inc. offers a Mechanical Engineering Internship for summer 2027.

You will design, simulate, and test mechanical and thermal systems supporting advanced semiconductor technologies, working as an equal contributor on a team of leading engineers inside a broad internship program. Based on your resume, you will be aligned to the Mechanical Engineering track, with opportunities to gain real-world experience in IC packaging, thermal modeling, and cooling solutions, in a program