Mechanical Engineering Intern: Thermal & IC Packaging

Qualcomm; Austin (TX); On-site; USD 23,000 - 135,000; Full time

Benefits offered by this job

Relocation coverage

Furnished housing accommodations

Job summary

Qualcomm Technologies, Inc. is seeking a Mechanical Engineering Intern in Austin for a 11–14 week summer program. You will design, simulate, and test mechanical and thermal systems supporting advanced semiconductor tech, collaborating with a team of engineers on IC packaging and cooling solutions.

Alignment to Mechanical Engineering track based on resume. Qualified students gain hands-on experience, mentorship, relocation assistance, and housing during the internship, with opportunities to

Qualifications

• Currently enrolled in a bachelor’s, master’s, or Ph.D. degree program in mechanical engineering, materials science, or a related field.
• Must be available for 11–14 weeks during Summer 2027 (May–September).
• Expected graduation date of November 2027 or later.
• 1+ years of academic experience with programming languages such as Python, Matlab.

Responsibilities

• Design, simulate, and test mechanical and thermal systems for Qualcomm’s semiconductor tech.
• Contribute on IC packaging, chip/package co-design, and cooling solutions.
• Work as an equal contributor on a team of leading engineers.

Skills

Python

MATLAB

Education

Bachelor's/Master's/PhD in mechanical engineering or related field

Tools

Cadence Sip

AutoCAD

SolidWorks

Job description

Qualcomm Technologies, Inc. is seeking a Mechanical Engineering Intern in Austin for a 11–14 week summer program. You will design, simulate, and test mechanical and thermal systems supporting advanced semiconductor tech, collaborating with a team of engineers on IC packaging and cooling solutions.

Alignment to Mechanical Engineering track based on resume. Qualified students gain hands-on experience, mentorship, relocation assistance, and housing during the internship, with opportunities to