Packaging Engineer Intern

MACOM Technology Solutions Holdings, Inc.; Milpitas (CA); On-site; USD 28,000 - 65,000; Part time

Job summary

MACOM invites an enthusiastic Packaging Engineer Intern to join our team in Milpitas, CA for a 12-week program. You will assist with bump mask design, substrate design, and thermal analyses while working under a senior engineer's guidance.

Ideal candidates are pursuing Mechanical or Thermal Engineering, proficient in Autocad/Solidworks, and familiar with FEA tools such as ANSYS, Icepak, or Flotherm. Expected hourly range: $20–$47 per hour, commensurate with experience and location.

Qualifications

• Pursuing a degree in mechanical/thermal engineering with coursework in packaging.
• Hands-on design and analysis experience in packaging concepts and processes.
• Familiar with design reviews and manufacturing guidelines for IC packaging.

Responsibilities

• Assist Packaging Engineer with bump mask design and substrate design tasks.
• Conduct thermal analysis and support design reviews to ensure manufacturability.
• Contribute to project delivery and present results at internal sessions.
• Gain hands-on experience through a defined internship project.

Skills

Autocad

Solidworks

FEA tools

Education

Mechanical / Thermal Engineering student

Tools

ANSYS

Icepak

Flotherm

Job description

MACOM (NASDAQ: MTSI) is a global leader in the design and manufacture of advanced semiconductor products across a diverse range of end markets, including Data Centers, Telecommunications, Industrial and Aerospace and Defense. We develop innovative, cutting-edge technologies and products across the spectrum of radio frequency (RF), microwave, millimeter wave, photonics and high-speed analog technologies. Our solutions support critical network infrastructure applications like artificial intelligence, high performance computing, satellite communications, radar, unmanned aerial vehicles, medical equipment, test and measurement and advanced wireless networks.MACOM has more than 75 years of expertise in semiconductor process development, wafer fabrication, circuit design, advanced packaging, systems architecture and applications engineering. We are committed to our customers’ success. We partner with customers to help solve their most challenging problems by providing semiconductor solutions that are at the forefront of the highest power, highest frequency and/or highest data rates.Leading technologies, innovative products and driven employees. Come be a part of MACOM and help advance the next generation of connectivity infrastructure!**Packaging Engineer Intern****Job Description and Responsibilities:**To assist the Packaging Engineer to perform several of the job functions required to package bumped IC to adhere to customer specifications and meet reliability and manufacturing specifications**The job functions may include:**• Bump Mask Design• Substrate Design• Thermal Analysis• Perform design reviews to ensure adherence to manufacturing guidelines**Job Requirements:**• Student in Mechanical / Thermal Engineering• Working knowledge of Autocad / Solidworks• Working knowledge of FEA tools (ANSYS/Icepak / Flotherm)**During the 12 weeks each Intern will:**• Be given an individual and well-defined project with set outcome goals• Gain hands on experience• Receive excellent training and ongoing supervision• Be invited to attend an intern webinar series• Attend networking/social events• Attend and present at Poster Session about each Interns project successes and pitfalls• Receive formal, written feedbackThe Hourly Range for this position is $20 – $47 per hour. Actual salary offered to candidate will depend on several factors, including but not limited to, work location, relevant candidates’ experience, education, and specific knowledge, skills, and abilities.