Semiconductor Packaging Intern: Hands-on Prototyping & Fast Iterations

Atomic Semi

Austin (TX)

Hybrid

USD 108,000 - 126,000

Full time

14 days+

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Benefits offered by this job

Housing stipend
Stocked office kitchen with snacks
Weekly learning & development
Commuter benefits
Paid time off
Visa sponsorship
Medical, dental, and vision insurance
401(k) retirement plan
Life and disability insurance

Job summary

fab2 is seeking Semiconductor Packaging Engineering Interns for the summer term in Austin, TX. The role spans end-to-end packaging process development, providing exposure to hands-on research, prototyping, and data analysis.

You will design, test, and iterate on new packaging approaches and tools, with training on our equipment and a portfolio demonstrating built projects. Applicants should be pursuing an engineering degree and have 1–2 hands-on lab experiences.

Qualifications

  • Pursuing a Bachelor’s Degree or higher in engineering.
  • 1–2 hands-on wet lab or lab-adjacent experiences, ideally in metal plating work or fabricating devices
  • Strong foundation in mechanical engineering (Solidworks/Onshape, materials selection, etc.)
  • Hands-on prototyping experience and the ability to move through design cycles quickly

Responsibilities

  • Design and iterate on machines and subsystems for semiconductor packaging fabrication, such as laser ablation machines, reflow ovens, and automated metal plating facilities
  • Integrate mechanical, electrical, and optical components in system assembly, including wiring, optics alignment, and electronics
  • Collaborate with cross-functional teams to continuously improve fabrication processes and equipment
  • Hands-on package/wafer processing (3d printing, metal plating, lithography, metrology)

Skills

Hands-on prototyping
Mechanical engineering foundation
Solidworks/Onshape
Design iteration speed

Education

Bachelor’s Degree in engineering

Tools

3D Printing
Lasering
Metrology tools

Job description

fab2 is seeking Semiconductor Packaging Engineering Interns for the summer term in Austin, TX. The role spans end-to-end packaging process development, providing exposure to hands-on research, prototyping, and data analysis.

You will design, test, and iterate on new packaging approaches and tools, with training on our equipment and a portfolio demonstrating built projects. Applicants should be pursuing an engineering degree and have 1–2 hands-on lab experiences.

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