Next-Gen Semiconductor Process Engineer (Metrology)

Intel Corporation; Hillsboro (OR); Hybrid; USD 134,000 - 189,000; Full time

Job summary

Intel is seeking a Module Development Engineer in Hillsboro, Oregon, to lead the development, optimization, and integration of advanced manufacturing processes and metrology for next-generation semiconductor products.

The role interfaces with cross-functional teams and suppliers, leveraging SPC/DOE and data-driven methods to solve complex challenges while advancing Intel's technology roadmap and high-volume manufacturing readiness.

Qualifications

• Master's degree with 3+ years of relevant industry experience, or PhD with 1+ year.
• Strong knowledge of Statistical Process Control (SPC) and Design of Experiments (DOE).
• Experience with semiconductor processing, system controls, and material processing.

Responsibilities

• Develop, optimize, and integrate advanced manufacturing processes and metrology.
• Lead pathfinding activities to support development of innovative processes for next-generation products.
• Collaborate with suppliers to evaluate enabling technologies for Intel's manufacturing environment.
• Drive process and equipment improvements to enhance performance, yield, efficiency, and manufacturability.
• Monitor industry trends to shape future manufacturing strategies and cost-effective roadmaps.
• Collaborate with cross-functional teams to ensure process compatibility across upstream and downstream operations.
• Apply SPC, DOE, and data-driven methods to solve complex technical challenges.

Skills

SPC

DOE

Semiconductor processing

System controls

Education

Master's degree in Materials Science, Chemical Engineering, Electrical Engineering, Physics, Mechanical Engineering, or related field

PhD in related fields

Job description

Intel is seeking a Module Development Engineer in Hillsboro, Oregon, to lead the development, optimization, and integration of advanced manufacturing processes and metrology for next-generation semiconductor products.

The role interfaces with cross-functional teams and suppliers, leveraging SPC/DOE and data-driven methods to solve complex challenges while advancing Intel's technology roadmap and high-volume manufacturing readiness.