Semiconductor Device Modeling Engineer (OMI)

Intel; Hillsboro (OR); On-site; USD 129,000 - 245,000; Full time

Benefits offered by this job

Stock bonuses

Health benefits

Retirement plan

Vacation

Job summary

Intel in Hillsboro, Oregon is seeking a semiconductor device modeling engineer to support compact modeling activities for next‑generation technologies. You will work with CDMG and DTP on OMI‑based modeling, BSIM‑CMG, and device physics, collaborating across teams to ensure accurate models powering data‑centric applications.

Role requires strong background in device physics, programming, and hands‑on experience with SPICE simulators; cross‑geography collaboration is essential.

Qualifications

• Bachelor's degree in Electrical Engineering or related discipline with 5+ years of experience or a related advanced degree.
• Ph.D. in Electrical Engineering or related discipline with 3+ years in semiconductor field.
• Experience in semiconductor device physics or 5+ years in the field.
• 1+ years' experience Python scripting for data analysis, automation and documentation.

Responsibilities

• Support compact modeling activities for Intel's new technologies.
• Collaborate across teams and geographies to optimize models.
• Develop and validate models and simulations using OMI, HSPICE, and Spectre.

Skills

Python scripting

Machine learning

Open Model Interface (OMI)

BSIM-CMG

Device modeling

HSPICE

Spectre

ICCAP

MBP

FinFET

GAA

Education

Bachelor's degree in Electrical Engineering or related discipline

Master's degree in Electrical Engineering or related discipline

Ph.D. in Electrical Engineering or related discipline

Tools

ICCAP

MBP

HSPICE

Spectre

Job description

Intel in Hillsboro, Oregon is seeking a semiconductor device modeling engineer to support compact modeling activities for next‑generation technologies. You will work with CDMG and DTP on OMI‑based modeling, BSIM‑CMG, and device physics, collaborating across teams to ensure accurate models powering data‑centric applications.

Role requires strong background in device physics, programming, and hands‑on experience with SPICE simulators; cross‑geography collaboration is essential.