Microelectronics Manufacturing Engineer: Die Bond & Wire Bond

NR Consulting; Torrance (CA); On-site; USD 80,000 - 130,000; Full time

Job summary

NR Consulting in Torrance, CA is seeking an engineer with hands-on microelectronics assembly experience to lead critical projects at our facility. The role blends technical expertise with project leadership, requiring a self-starter attitude in a dynamic environment.

Responsibilities include learning and applying die-bonding and wire-bonding processes, qualifying new products, and partnering with multi-functional teams to deliver robust wire-bond solutions.

Qualifications

• Bachelor’s degree in engineering and relevant manufacturing experience.
• Experience in PCBAs or microelectronics manufacturing processes.
• Minimum 2 years experience for Level II; 4 years for Level III; 6 years for Level IV.

Responsibilities

• Assist production team with die-bonding and wire-bonding processes, including equipment and tools.
• Qualify new products and lines at Torrance production site.
• Collaborate with cross-functional teams to develop wire-bond solutions for business needs.
• Provide training in die-assembly and wire-bond technology.

Skills

Die-assembly experience

Microscope operation

Analytical skills

Self-motivation

Interpersonal skills

Education

Bachelor's degree in mechanical, manufacturing, or electrical engineering

Tools

Die-bonding equipment

Wire-bonding machines

Precision pick-and-place

Job description

NR Consulting in Torrance, CA is seeking an engineer with hands-on microelectronics assembly experience to lead critical projects at our facility. The role blends technical expertise with project leadership, requiring a self-starter attitude in a dynamic environment.

Responsibilities include learning and applying die-bonding and wire-bonding processes, qualifying new products, and partnering with multi-functional teams to deliver robust wire-bond solutions.