Microelectronics Failure Analysis Engineer

SpaceX; Texas; On-site; USD 110,000 - 160,000; Full time

Job summary

SpaceX is seeking a Failure Analysis Engineer, Microelectronics for Starlink to perform root cause analyses on microelectronic components and packaging used in manufacturing, testing, and field returns. You will apply advanced FA tools to identify failure mechanisms and drive corrective actions that improve reliability of satellites and user terminals.

Responsibilities include end-to-end investigations, electrical fault isolation, physical failure analysis, and reporting.

Qualifications

• Bachelor's degree in a STEM discipline and hands-on failure analysis experience.
• 2+ years in microelectronics failure analysis or materials characterization.

Responsibilities

• Own end-to-end root cause failure analysis investigations for microelectronics failing in manufacturing, test, and field.
• Conduct advanced electrical fault isolation and characterization using curve trace, TDR, RF characterization, LIT, OBIRCH, EBIRCH, nanoprobing, and related techniques.
• Perform advanced physical FA using SEM, FIB, EDS, cross-sectioning to identify failure mechanisms in silicon, packaging, and interconnects.
• Apply physics-of-failure principles to determine root causes and drive corrective actions with design/manufacturing teams.
• Author detailed technical reports documenting failure modes, root cause conclusions, data, and corrective action effectiveness.
• Develop and improve FA techniques and workflows for new packaging technologies and materials.

Skills

Root cause analysis

Problem solving

Technical writing

Communication

Education

Bachelor's degree in materials science, electrical engineering, physics, chemical engineering

Master's or PhD in materials science, electrical engineering, physics, chemical engineering

Tools

SEM

FIB

EDS

Cross-sectioning

OBIRCH

EBIRCH

SAM

IV curves

RF characterization

LIT

NANOPROBING

PHOTON EMISSION

Job description

SpaceX is seeking a Failure Analysis Engineer, Microelectronics for Starlink to perform root cause analyses on microelectronic components and packaging used in manufacturing, testing, and field returns. You will apply advanced FA tools to identify failure mechanisms and drive corrective actions that improve reliability of satellites and user terminals.

Responsibilities include end-to-end investigations, electrical fault isolation, physical failure analysis, and reporting.