Senior Microelectronics Failure Analysis Engineer

Starlink; Bastrop (TX); Sur place; USD 140 000 - 230 000; Plein temps

Résumé du poste

SpaceX is seeking a Sr. Failure Analysis Engineer, Microelectronics (Starlink), to lead root cause investigations of microelectronic devices used in manufacturing and fielded hardware.

You will apply advanced FA techniques to identify failure mechanisms and guide corrective actions across silicon, packaging, and interconnects. The role requires deep knowledge of semiconductor failure modes, hands-on FA tool proficiency, and collaboration with design and manufacturing teams.

Qualifications

• Bachelor’s degree in a STEM field with 5+ years of hands-on microelectronics failure analysis experience.
• Experience applying JEDEC and AEC reliability standards and physics-of-failure methodologies.
• Strong data-analysis skills using Python or similar tools.

Responsabilités

• Own end-to-end root cause failure analysis investigations on microelectronics in manufacturing, test, and field.
• Perform advanced electrical fault isolation and characterization using specialized techniques.
• Use SEM, FIB, EDS, cross-sectioning to identify failure mechanisms in devices.
• Apply physics-of-failure knowledge to determine root causes and drive corrective actions.
• Write detailed technical reports documenting failure modes and corrective action effectiveness.

Connaissances

Root cause analysis

Electrical fault isolation

Python

Data analysis

Technical writing

Communication

Problem solving

Formation

Bachelor’s degree in STEM field

Outils

SEM

FIB

EDS

Cross-sectioning

OBIRCH

EBIRCH

SAM

EBAC

Nanoprobing

Description du poste

SpaceX is seeking a Sr. Failure Analysis Engineer, Microelectronics (Starlink), to lead root cause investigations of microelectronic devices used in manufacturing and fielded hardware.

You will apply advanced FA techniques to identify failure mechanisms and guide corrective actions across silicon, packaging, and interconnects. The role requires deep knowledge of semiconductor failure modes, hands-on FA tool proficiency, and collaboration with design and manufacturing teams.