Senior Microelectronics Failure Analysis Engineer

SPACE EXPLORATION TECHNOLOGIES CORP; Bastrop (TX); Hybrid; USD 140,000 - 210,000; Full time

Job summary

SpaceX (Space Exploration Technologies Corp) is seeking a Sr. Failure Analysis Engineer focusing on microelectronics for Starlink.

You will lead root cause analyses, using advanced FA tools to isolate faults in silicon, packaging and interconnects, and drive corrective actions across design and manufacturing teams. The role requires deep expertise in FA methods, semiconductor physics, and data interpretation, with strong reporting and collaboration to ensure reliability of satellites and user

Qualifications

• Bachelor’s degree in materials science, electrical engineering, physics, chemical engineering, or other STEM field.
• 5+ years in microelectronics failure analysis or materials characterization.
• Experience with FA tools (SEM, FIB, EDS) and physics-of-failure methods.
• Strong problem-solving, communication and technical writing skills.

Responsibilities

• Own end-to-end root cause FA investigations on microelectronics in manufacturing, test and field.
• Conduct advanced electrical fault isolation and characterization using curve trace, TDR, RF, LIT and related techniques.
• Perform advanced physical FA using SEM, FIB, EDS, cross-sectioning to identify failure mechanisms.
• Apply physics-of-failure to determine root causes and drive corrective actions with teams.
• Author detailed reports documenting failure modes, data, and corrective action effectiveness.

Skills

Electrical fault isolation

SEM

FIB

EDS

Physics-of-failure

Python

Technical writing

Data analysis

IV curves

Education

Bachelor's degree in STEM

Master's or PhD in STEM

Tools

SEM

FIB

EDS

Cross-sectioning

SAM

OBIRCH

EBIRCH

EBAC

Nanoprobing

Job description

SpaceX (Space Exploration Technologies Corp) is seeking a Sr. Failure Analysis Engineer focusing on microelectronics for Starlink.

You will lead root cause analyses, using advanced FA tools to isolate faults in silicon, packaging and interconnects, and drive corrective actions across design and manufacturing teams. The role requires deep expertise in FA methods, semiconductor physics, and data interpretation, with strong reporting and collaboration to ensure reliability of satellites and user