Next-Gen CMOS Device Integration Engineer

Micron Technology, Inc.; Boise (ID); On-site; USD 140,000 - 210,000; Full time

Benefits offered by this job

Medical insurance

Dental coverage

Vision plan

Paid time off

Paid holidays

Job summary

Micron Technology, Inc. seeks a Staff Engineer to advance CMOS devices for next-generation memory products. You will solve integration challenges, analyze electrical performance, and collaborate with Design, TCAD, Modeling, Process, Reliability, and Layout teams to drive technology improvements.

You will help enable memory technologies for AI, HPC, and emerging applications, communicating findings and guiding decisions across cross-functional teams.

Qualifications

• Master's degree or PhD in Electrical Engineering or equivalent practical experience.
• 5+ years of hands-on experience in advanced CMOS device development, characterization, and/or integration.
• Semiconductor industry experience in advanced logic or DRAM technology development.
• Experience collaborating across engineering fields to solve sophisticated device or process integration challenges.

Responsibilities

• Develop and integrate advanced CMOS devices for next-generation DRAM, HBM, and emerging memory architectures.
• Characterize and analyze CMOS devices and circuits to identify performance opportunities and guide technology improvements.
• Partner with Design, TCAD, Modeling, Process, Reliability, and Layout teams to develop integrated technology solutions.
• Lead technical investigations, communicate findings, and provide recommendations that support technology development decisions.

Skills

CMOS device development

Device characterization

Cross-functional collaboration

Electrical engineering insight

Communication of findings

Education

Master's or PhD in Electrical Engineering

Job description

Micron Technology, Inc. seeks a Staff Engineer to advance CMOS devices for next-generation memory products. You will solve integration challenges, analyze electrical performance, and collaborate with Design, TCAD, Modeling, Process, Reliability, and Layout teams to drive technology improvements.

You will help enable memory technologies for AI, HPC, and emerging applications, communicating findings and guiding decisions across cross-functional teams.