Memory Packaging & Interconnect Engineer (Remote-Friendly)

HushOne, Inc.; Kirkland (WA); On-site; USD 140,000 - 190,000; Full time

Benefits offered by this job

Stock options

401(k) with company match

Gym membership

Job summary

HushOne, Inc. is seeking an engineering professional to evaluate memory packaging, subsystems, and high-speed interconnects. You will translate bandwidth and reliability needs into practical options and work with architecture, signal-integrity, supplier, and manufacturing teams.

In the first 90 days, you will deliver a comprehensive memory trade study detailing cost, availability, validation, and service implications, with a focus on end-to-end performance across packaging and modules.

Qualifications

• Advanced packaging, memory subsystems, or high-speed interconnect engineering.

Responsibilities

• Evaluate packaging, memory technologies, high-speed links, thermal coupling and assembly constraints.
• Coordinate with architecture, signal-integrity, supplier and manufacturing teams.
• Translate bandwidth and reliability requirements into realistic physical and commercial options.
• Deliver a memory package trade study within 90 days after program activation.

Skills

Advanced packaging, memory subsystems,

Job description

HushOne, Inc. is seeking an engineering professional to evaluate memory packaging, subsystems, and high-speed interconnects. You will translate bandwidth and reliability needs into practical options and work with architecture, signal-integrity, supplier, and manufacturing teams.

In the first 90 days, you will deliver a comprehensive memory trade study detailing cost, availability, validation, and service implications, with a focus on end-to-end performance across packaging and modules.