Memory Design Engineer – HBM & CMOS RTL Expert

Micron Technology, Inc.; Texas; On-site; USD 120,000 - 180,000; Full time

Benefits offered by this job

Medical, dental, and vision plans

Paid time off

Paid holidays

Benefits guide

Job summary

Micron Technology, Inc. is seeking a Design Engineer in the Heterogeneous Integration Group to design and analyze digital and analog circuits for memory products.

You will collaborate with global teams across design, verification, and manufacturing to deliver high-density, low-power memory solutions. You will apply simulation, modeling, and verification to improve design quality and manufacturability, supporting tape-out readiness and technology scaling while driving cross-functional

Qualifications

• Bachelor's degree in Electrical Engineering or equivalent practical experience.
• 4+ years of relevant experience with a Bachelor's degree, or 2+ years with a Master's degree.
• Extensive knowledge of CMOS circuit design and semiconductor device physics.
• Experience with schematic entry, Verilog, FastSPICE, and HSPICE simulations.
• Strong understanding of timing, area, power, and complexity trade-offs in DRAM or mixed-signal design.

Responsibilities

• Contribute to circuit design, layout, and optimization for memory and logic or analog circuits.
• Perform parasitic modeling and support design validation including tape-out revisions.
• Oversee layout process including floor-planning, placement, and routing.
• Perform verification using modeling, simulation, and AI-assisted analysis.

Skills

CMOS design

Timing analysis

Scripting

RTL design flow

Problem solving

Education

BSc in Electrical Engineering

Tools

Verilog

FastSPICE

HSPICE

Job description

Micron Technology, Inc. is seeking a Design Engineer in the Heterogeneous Integration Group to design and analyze digital and analog circuits for memory products.

You will collaborate with global teams across design, verification, and manufacturing to deliver high-density, low-power memory solutions. You will apply simulation, modeling, and verification to improve design quality and manufacturability, supporting tape-out readiness and technology scaling while driving cross-functional