Mechanical Engineer II - Packaging, Thermal & DFM

Cisco; San Jose (CA); On-site; USD 120,000 - 180,000; Full time

Job summary

Cisco in San Jose is seeking a Mechanical Engineer to lead mechanical design from concept through manufacturing. You will own details like tolerance analysis, BOM management, and packaging design, while coordinating with hardware, ECAD, test, and supplier teams to optimize cost and manufacturability.

The role emphasizes Design for Manufacturing, reliability testing, and translating concepts into robust packaging solutions for high-reliability hardware platforms.

Qualifications

• Master's degree or Bachelor's degree with relevant years of experience as specified (within 3 years for Master’s; 2 years for Bachelor's).
• Proven experience executing mechanical designs, tolerance stack-up analyses, and feasibility testing for hardware products.
• Hands-on experience with prototype fabrication, assembly, and failure/reliability testing processes.
• Basic understanding of thermal and electrical engineering principles as applied to mechanical packaging and board layout.
• Strong collaborative skills to work across cross-functional teams (Hardware, ECAD, Test Assurance) and manage single-product BOMs.

Responsibilities

• Own key aspects of product development, including detailed mechanical design, tolerance stack-up analysis, BOM management, and component assembly.
• Perform DFM optimizations, failure analysis, and reliability testing.
• Define efficient manufacturing processes that optimize product design and cost.
• Collaborate with thermal and supplier quality engineers to refine heat sink designs and enclosure solutions.

Skills

Mechanical design

Tolerance analysis

BOM management

DFM

Prototyping

Cross-functional teamwork

Education

Master's degree in Mechanical Engineering

Bachelor's degree in Mechanical Engineering

Tools

ECAD

Job description

Cisco in San Jose is seeking a Mechanical Engineer to lead mechanical design from concept through manufacturing. You will own details like tolerance analysis, BOM management, and packaging design, while coordinating with hardware, ECAD, test, and supplier teams to optimize cost and manufacturability.

The role emphasizes Design for Manufacturing, reliability testing, and translating concepts into robust packaging solutions for high-reliability hardware platforms.