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Broadcom's Compute and Switching Group is seeking a Mechanical Engineer focused on high-power system enclosure design and liquid cooling infrastructure. You will contribute from concept through NPI production, leading thermo-mechanical lab operations and cross-functional collaboration.
The role emphasizes validating heatsinks, vapor chambers, and liquid cooling solutions, performing system-level tests, and coordinating with vendors and production teams to bring designs to volume.
We are seeking a highly motivated Mechanical Engineer with expertise in system enclosure design and liquid cooling infrastructure to join our dynamic team at Broadcom's CSG (Compute and Switching Group). The successful candidate will play a key role in the full hardware development cycle, from concept through NPI production, with a focus on high-power system enclosure design, system bring-up, and validation.
CSG develops advanced system-on-chip (SoC) devices for a wide variety of market segments. Our team designs reference and validation systems that enable customers to meet critical constraints in space, thermal management, manufacturability, and scalability. This is an exciting opportunity to help shape next-generation switch platforms and influence datacenter infrastructure at scale.
Broadcom offers a competitive and comprehensive benefits package:
The company follows all applicable laws for Paid Family Leave and other leaves of absence.
Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.
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