Manufacturing Engineer – Microelectronics & Wire Bonding

Stellant Systems, Inc.; Torrance (CA); On-site; USD 80,000 - 130,000; Full time

Job summary

Stellant Systems, Inc. in Torrance, CA is seeking a Manufacturing Engineer with hands-on microelectronics assembly experience to join our production facility.

This role combines technical acumen with project leadership in a dynamic environment, focusing on die-bonding and wire-bonding work. The ideal candidate will qualify new products, collaborate across functions, and train others in die-assembly and wire-bond technology while maintaining precision under a microscope.

Qualifications

• Bachelor’s degree in mechanical, manufacturing, or electrical engineering.
• Experience in manufacturing engineering of PCBAs, microelectronics, or similar processes.
• Ability to work under a microscope for extended periods and have fine motor skills.
• Self-motivated and able to work independently.
• Excellent communication and teamwork skills.

Responsibilities

• Help production team with learning and understanding die-bonding, and wire bonding assembly processes, skills, tools, and equipment.
• Qualify new products and new product lines at Torrance production site.
• Collaborate with other functional groups to develop wire bond solutions to meet business needs.
• Provide training in die-assembly, wire bond technology, problem analysis and resolution.
• Must have knowledge and understanding of: ability to work under a microscope and dexterity.

Skills

Die bonding

Wire bonding

Microscope work

Problem solving

Communication

Education

Bachelor's degree in mechanical, manufacturing, or electrical engineering

Tools

Die-attach equipment

Wire-bonding machines

PCBAs

Job description

Stellant Systems, Inc. in Torrance, CA is seeking a Manufacturing Engineer with hands-on microelectronics assembly experience to join our production facility.

This role combines technical acumen with project leadership in a dynamic environment, focusing on die-bonding and wire-bonding work. The ideal candidate will qualify new products, collaborate across functions, and train others in die-assembly and wire-bond technology while maintaining precision under a microscope.