Manufacturing Engineer

Stellant Systems, Inc.; Torrance (CA); On-site; USD 80,000 - 130,000; Full time

Job summary

Stellant Systems, Inc. in Torrance, CA is seeking a Manufacturing Engineer with hands-on microelectronics assembly experience to join our production facility.

This role combines technical acumen with project leadership in a dynamic environment, focusing on die-bonding and wire-bonding work. The ideal candidate will qualify new products, collaborate across functions, and train others in die-assembly and wire-bond technology while maintaining precision under a microscope.

Qualifications

• Bachelor’s degree in mechanical, manufacturing, or electrical engineering.
• Experience in manufacturing engineering of PCBAs, microelectronics, or similar processes.
• Ability to work under a microscope for extended periods and have fine motor skills.
• Self-motivated and able to work independently.
• Excellent communication and teamwork skills.

Responsibilities

• Help production team with learning and understanding die-bonding, and wire bonding assembly processes, skills, tools, and equipment.
• Qualify new products and new product lines at Torrance production site.
• Collaborate with other functional groups to develop wire bond solutions to meet business needs.
• Provide training in die-assembly, wire bond technology, problem analysis and resolution.
• Must have knowledge and understanding of: ability to work under a microscope and dexterity.

Skills

Die bonding

Wire bonding

Microscope work

Problem solving

Communication

Education

Bachelor's degree in mechanical, manufacturing, or electrical engineering

Tools

Die-attach equipment

Wire-bonding machines

PCBAs

Job description

Job Location: Torrance, CA

Salary: $80,000-$130,000/yr Depending on experience and level

We are seeking a motivated engineer with hands‑on experience in microelectronics assembly to play a critical role at our facility in Torrance, CA. This role offers a unique opportunity to combine technical acumen with project leadership skills. The ideal candidate is a self‑starter, comfortable working in a dynamic environment, and eager to take on a key role in highly visible projects.

Overview

Job Title: Manufacturing Engineer

Job Location: Torrance, CA

Salary: $80,000-$130,000/yr Depending on experience and level

We are seeking a motivated engineer with hands‑on experience in microelectronics assembly to play a critical role at our facility in Torrance, CA. This role offers a unique opportunity to combine technical acumen with project leadership skills. The ideal candidate is a self‑starter, comfortable working in a dynamic environment, and eager to take on a key role in highly visible projects.

Responsibilities

• Help production team with learning and understanding die-bonding, and wire bonding assembly processes, skills, tools, and equipment.
• Qualify new products and new product lines at Torrance production site.
• Collaborate with other functional groups to develop wire bond solutions to meet business needs.
• Provide training in die-assembly, wire bond technology, problem analysis and resolution.
• Must have knowledge and understanding of:
• Ability to work under a microscope for extended periods of time
• Ability to have eye to hand dexterity and fine motor skills

Qualifications

This role requires relevant engineering experience that includes a combination of or equivalent experience in manufacturing engineering of PCBAs, microelectronics, or similar manufacturing processes.

• Level II: requires a minimum of 2 years of relevant experience and a bachelor’s degree in mechanical, manufacturing, or electrical engineering discipline.
• Level III: requires a minimum of 4 years of relevant experience and a bachelor’s degree in mechanical, manufacturing, or electrical engineering discipline.
• Level IV: requires a minimum of 6 years of relevant experience and a bachelor’s degree in mechanical, manufacturing, or electrical engineering discipline.

Role also requires:

• Bachelor’s Degree in Materials, Chemical, Mechanical, Electrical & Electronic Engineering.
• Extensive experience with Microelectronic device process development including Eutectic die attach, precision pick and place and wire-bonding machines. Good analytical and problem-solving skills
• Self-motivated, able to work independently and self-initiative personality
• Possesses good communication skills, interpersonal skills and ability to work with multi-functional teams

Sstellt Systems is an Equal Opportunity/Affirmative Action Employer. We consider applicants without regard to race, color, religion, age, national origin, ancestry, ethnicity, gender, gender identity, gender expression, sexual orientation, marital status, veteran status, disability, genetic information, citizenship status or membership in any other group protected by federal, state or local law.

To conform to U.S. Government export regulations, the applicant must be a U.S. citizen, lawful permanent resident of the U.S. (e.g. Green Card holder), or a protected individual as defined by the International Traffic in Arm Regulations (ITAR).