Lean Manufacturing Engineer

Teledyne Micropac; Garland (TX); On-site; USD 90,000 - 125,000; Full time

Benefits offered by this job

Growth opportunities

Retirement plans

Tuition reimbursement

Paid holidays

Job summary

Teledyne Micropac is seeking a Lean Manufacturing Engineer to lead hands-on technical efforts to develop, optimize, and sustain high‑reliability microelectronics manufacturing processes from handoff to production.

The role emphasizes process stability, yield improvement, scrap reduction, and production readiness by applying Lean, Six Sigma, and structured problem‑solving methods while partnering with engineering, quality, and manufacturing teams on new product introductions and process changes.

Qualifications

• Associate’s degree is required.
• 7+ years of experience in manufacturing engineering or continuous improvement.
• Hands-on experience with microelectronics or high-reliability processes (wire bonding, die attach, hermetic sealing, welding, precision assembly).
• Strong cross-functional communication across design, quality and manufacturing.
• Ability to manage multiple technical initiatives, track actions and risks, and drive closure.
• Lean Six Sigma Green Belt or similar certification is preferred.
• Knowledge of Lean, Six Sigma, standard work, and yield improvement methodologies is preferred.
• Experience in aerospace, defense, medical, or other regulated environments is preferred.
• Experience using ERP/MRP systems is preferred.

Responsibilities

• Develop, modify, and optimize manufacturing processes from handoff to full-scale production.
• Provide hands-on technical leadership for microelectronics processes.
• Lead DFM reviews coordinating design and manufacturing.
• Analyze data to define operating limits and control parameters.
• Plan and execute DoEs and capability studies; support new tools and automation.
• Support reliability activities and failure analysis improvements.
• Lead continuous improvement to improve yield, scrap reduction, throughput, and stability.
• Ensure shop-floor execution aligns with standards and KPIs.
• Coordinate cross-functional efforts for NPI, ECRs, and process improvements.
• Document and reflect shop-floor execution in engineering docs.

Skills

Cross-functional

Lean Sigma Green Belt

Problem solving

Data analysis

ERP/MRP

Education

Associate’s degree in engineering

Tools

ERP/MRP

Job description

Teledyne Micropac is looking for a Lean Manufacturing Engineer who will provide hands‑on technical leadership to develop, optimize, and sustain high‑reliability microelectronics manufacturing processes from engineering handoff through full‑scale production. This role focuses on process stability, yield improvement, scrap reduction, and production readiness by applying Lean, Six Sigma, and structured problem‑solving methods. This role will partner closely with engineering, quality, and manufacturing teams to support new product introductions, process changes, and continuous improvement initiatives while ensuring shop‑floor execution aligns with documented standards and KPIs.

What you'll do

The essential functions and key responsibilities for the position include, but are not limited to:

• Develop, modify, and optimize manufacturing processes from engineering handoff through full‑scale production.
• Provide hands‑on technical leadership for critical microelectronics processes, including wire bond, epoxy die attach, hermetic sealing, welding, lid attach, leak testing, and assembly.
• Lead and facilitate DFM reviews, ensuring early and effective collaboration between design engineering and manufacturing.
• Analyze process and test data to define operating limits, specifications, and control parameters.
• Plan and execute DoEs, equipment capability studies, and support the introduction of new tools, fixtures, and automation technologies.
• Support reliability engineering activities including material evaluations, component assessments, failure analysis support, and reliability improvement recommendations.
• Lead and support continuous improvement initiatives focused on yield, scrap reduction, throughput, cost, and process stability.
• Apply Lean, Six Sigma, and structured problem‑solving methods to eliminate waste and improve execution.
• Support organization KPIs to monitor yield, rework, scrap, cycle time, and production readiness.
• Coordinate cross‑functional efforts for new product introductions, engineering changes, and process improvement projects.
• Ensure engineering documentation accurately reflects shop‑floor execution and drives execution discipline.

What you need

• Associate’s degree in engineering (Mechanical, Electrical, Materials, Industrial, or related discipline) — required
• 7+ years of experience in manufacturing engineering, process development, or continuous improvement — required
• Hands‑on experience with microelectronics or high‑reliability manufacturing processes such as wire bonding, die attach, hermetic sealing, welding, or precision assembly — required
• Strong cross‑functional communication skills with the ability to coordinate engineering, quality, and manufacturing teams — required
• Ability to manage multiple technical initiatives, track actions and risks, and drive timely closure — required
• Lean Six Sigma Green Belt or similar certification — preferred
• Working knowledge of Lean, Six Sigma, standard work, and yield improvement methodologies — preferred
• Experience in aerospace, defense, medical, or other regulated manufacturing environments — preferred
• Experience using ERP/MRP systems— preferred

What we offer

• Opportunities to grow within a global technology leader
• Competitive compensation and benefits
• Paid time off and holidays
• Retirement savings plans
• Tuition reimbursement and professional development support