Lean Manufacturing Engineer for Microelectronics

Teledyne Micropac; Garland (TX); On-site; USD 90,000 - 125,000; Full time

Benefits offered by this job

Growth opportunities

Retirement plans

Tuition reimbursement

Paid holidays

Job summary

Teledyne Micropac is seeking a Lean Manufacturing Engineer to lead hands-on technical efforts to develop, optimize, and sustain high‑reliability microelectronics manufacturing processes from handoff to production.

The role emphasizes process stability, yield improvement, scrap reduction, and production readiness by applying Lean, Six Sigma, and structured problem‑solving methods while partnering with engineering, quality, and manufacturing teams on new product introductions and process changes.

Qualifications

• Associate’s degree is required.
• 7+ years of experience in manufacturing engineering or continuous improvement.
• Hands-on experience with microelectronics or high-reliability processes (wire bonding, die attach, hermetic sealing, welding, precision assembly).
• Strong cross-functional communication across design, quality and manufacturing.
• Ability to manage multiple technical initiatives, track actions and risks, and drive closure.
• Lean Six Sigma Green Belt or similar certification is preferred.
• Knowledge of Lean, Six Sigma, standard work, and yield improvement methodologies is preferred.
• Experience in aerospace, defense, medical, or other regulated environments is preferred.
• Experience using ERP/MRP systems is preferred.

Responsibilities

• Develop, modify, and optimize manufacturing processes from handoff to full-scale production.
• Provide hands-on technical leadership for microelectronics processes.
• Lead DFM reviews coordinating design and manufacturing.
• Analyze data to define operating limits and control parameters.
• Plan and execute DoEs and capability studies; support new tools and automation.
• Support reliability activities and failure analysis improvements.
• Lead continuous improvement to improve yield, scrap reduction, throughput, and stability.
• Ensure shop-floor execution aligns with standards and KPIs.
• Coordinate cross-functional efforts for NPI, ECRs, and process improvements.
• Document and reflect shop-floor execution in engineering docs.

Skills

Cross-functional

Lean Sigma Green Belt

Problem solving

Data analysis

ERP/MRP

Education

Associate’s degree in engineering

Tools

ERP/MRP

Job description

Teledyne Micropac is seeking a Lean Manufacturing Engineer to lead hands-on technical efforts to develop, optimize, and sustain high‑reliability microelectronics manufacturing processes from handoff to production.

The role emphasizes process stability, yield improvement, scrap reduction, and production readiness by applying Lean, Six Sigma, and structured problem‑solving methods while partnering with engineering, quality, and manufacturing teams on new product introductions and process changes.